Benefits of Application Specific Abatement Strategy and Subtool Design
As the semiconductor industry continues to grow, production tool uptime, footprint reduction, operational cost, safety, and emissions are of increasing importance to all HVM manufacturers.
Subtool systems should always aim to optimize those factors, which can be achieved through application specific abatement method selection. Burn/wet abatements have become the predominant abatement method in the US but other approaches such as pre-pump plasma, wet scrubbers, absorbers, and other peripheral accessories all offer distinct advantages in the appropriate scenario. In addition to the methodology of abatement, the supporting software and hardware infrastructure is as important when designing a tool subsystem.