Chemical Mechanical Planarization (CMP) Process Hazards

McLean, Roderick
(Applied Materials, Santa Clara, CA)

Chemical mechanical planarization(CMP) is a critical process step in microchip fabrication. CMP enables the transition to smaller geometries by removing high topographic features and smooth the surface by polishing, preparing the wafer for another layer of deposition. CMP has physical and chemical safety hazards in particular rotary moving parts, robotics, lasers, and corrosive chemistry.

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