Improving Information Exchange Requirements Between Tool Installation and Facility

Chasey, Allan; Pindukuri, Shruthi
(Arizona State University, Tempe, AZ)

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Semiconductor manufacturing facilities are very complex and capital intensive. Construction involves high levels of uncertainty and aggressive schedules. During the various stages of the lifecycle of these facilities different disciplines come together, generate and use a tremendous amount of facility and process information to support multiple decisions that are required to successfully design, build and sustain these advanced facilities. In the highly fragmented construction industry, a majority of the information and processes taking place throughout the life cycle are neither integrated nor interoperable and result in a high degree of redundancy and waste. The semiconductor manufacturing industry in its constant quest to minimize the cost of its capital intensive facilities and speed project delivery to match production to available market window has recognized that the implementation of Building Information Modeling (BIM) can help achieve these goals. Leading semiconductor manufacturers have implemented pilot projects using BIM to understand the efficiency gains and the return on investment, implementing on both Base Build as well as Tool Install. While industry participants are developing business processes to integrate BIM into the current workflow, technologies and information standards need to be developed to facilitate this process. It is important to understand the flow of information between all the stakeholders for a holistic implementation of BIM and the standards available to facilitate the exchange of data. The presentation will focus on an interoperable Building Information Model (BIM) to support the Base-Build and Tool Installation process in a semiconductor manufacturing facility. To understand the nature of the flow of information between the various stakeholders the flow of information between the facility designer, process tool manufacturer and tool layout designer will be used as the basis for developing the information exchange framework. An information model for the base build and a process tool was built using industry standards SEMI E6 and SEMI E51 as a basis to model the information handoffs. Information modeling for a semiconductor manufacturing facility is unique in that it is a process model (Process Tool Information Model) within a building model (Building Information Model), each supported more robustly by different interoperability standards. Applications support interoperability data standards specific to the domain or industry they serve but information transfers need to occur between the various domains. To facilitate flow of information between the different domains a mapping of the industry standards must be undertaken and translators developed for business use.

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