SESHA 2009 Symposium Abstract

U.S. Climate Change Policy and the PFC Voluntary Agreement: Looking Forward

Gunning, Paul M.
(U.S. EPA)

TBA

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SESHA 2009 Speaker Biography

Paul M. Gunning
Chief, Non-CO2 Programs Branch , U.S. EPA

Mr. Gunning holds master degrees in environmental science and public administration and has over 17 years of experience in developing and implementing government-industry partnership programs. Working in both the public and private sectors Mr. Gunning has focused his efforts on environmental policy and program development and implementation. As a private consultant, Mr. Gunning has worked for the U.S. EPA, the Department of Agriculture and the Department of Defense in the area of strategic planning and environmental program implementation. He assisted EPA in developing goals, milestones, and implementation strategies for several program areas including water, air, solid waste management, energy efficiency, and pollution prevention. Mr. Gunning is currently the Chief of EPA’s Non-CO2 Programs Branch of EPA’s Climate Change Division. The Non-CO2 Programs Branch is responsible for the implementation of US programs that promote profitable opportunities for reducing emissions of methane and high-global warming potential gases. The branch is also responsible for the implementation of the Methane to Markets Partnership and supports the development of EPA’s Proposed Mandatory Greenhouse Gas Reporting Rule. In this role, he works cooperatively with a variety of companies and organizations in the energy, waste management, agriculture, and industrial sectors to implement programs that encourage cost-effective GHG mitigation strategies. Through these public-private partnerships, EPA helps partners overcome a wide range of informational, technical, and institutional barriers to identify and implement various mitigation technologies, management practices, and process changes that yield both economic and environmental benefits.

SESHA 2009 Symposium Abstract

Industry Economic Forecast

McClean, Bill
(IC Insights)

TBA

SESHA 2009 Speaker Biography

Bill McClean
President, IC Insights

Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 29 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

SESHA 2009 Symposium Abstract

The Role of Process Hazard Assessment in Semiconductor Process Development

Pardon, Alain
(IMEC)

Process Hazard Assessment (PHA) is developed by IMEC as a tool used to predict the ESH-impact of new semiconductor processes that are being investigated. The PHA is based upon a “process window “which is detailed in a Process Definition Sheet (PDS). The PDS gives maximum and estimated process flows as well as the physical conditions (temperature, pressure) of the process. The first step of the PHA is a Multi Criteria Hazard Assessment aiming to evaluate the physical hazards, toxicological effects as well as an evaluation of standards and regulations that apply to the use of the aimed precursors. The process recipe and stoechiometry allows us to investigate the chemical reactivity or physical effects of by-products. Effects of exothermal or endothermal reactions, built-up of solids, or release of explosive reaction products are assessed during this second stage of the PHA. If the reaction mechanisms are unknown the effects are investigated in an experimental way by monitoring the physical effects and by chemical analysis such as GCMS, FTIR,…while ramping-up the process from diluted chemicals and starting from benign process conditions. The outcome of the PHA allows one to select the technical and organizational measures to further develop or demonstrate the process under safe conditions. Segregation of drains and exhausts, installation of on-board fire extinguishing systems on tools, use of process diluents, adequate effluent abatement or the change of process precursors can be the result of a PHA. Also, the advantage of running a PHA in a systematical way lies in educating scientists in the ESH-effects of the products and process conditions that they select for process development, hence in safe and sustainable processes that can be transferred to the semiconductor manufacturers.

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SESHA 2009 Speaker Biography

Alain Pardon
ESH-Manager, IMEC

Alain Pardon is manager of the ESH-group at IMEC and leads the ESH-team. He has been involved in the safety of semiconductor process development for more than 20 years. IMEC is an international centre of excellence based in Belgium and housing 1600 scientists and technicians from more than 50 different nationalities. Its mission is to perform R&D, ahead of industrial needs by 3 to 10 years in microelectronics, nanotechnology, design methods and technology for ICT systems. One of its core activities is to develop and demonstrate semiconductor manufacturing processes. IMEC has a turnover of more than 250 MEuro.

SESHA 2009 Symposium Abstract

Dangers Created in Epitaxial Exhaust Lines by Partially Reacted Process Gases

Vickery, Earl
(Applied Technology Specialists, Inc., Bixby, Oklahoma)

Epitaxial depositions involving materials such as Silane and Phosphine are thermally cracked to produce Silicon or Phosphorus atoms and ions as part of the deposition process. Most of the gases injected into reactors during these operations remain unused and are expelled in the reactor exhaust lines. Cracked and partially cracked fractions, as well as partially reformed compounds, can be deposited on the exhaust line inner walls and are stable only under certain conditions and can unexpectedly react violently when these conditions change. These materials are often referred to as meta stable compounds and have been the cause of hundreds of millions of dollars in property and product losses. This paper will review one or more cases where these compounds have been the source of property loss and to present several solutions to minimize or eliminate the dangers they produce.

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SESHA 2009 Speaker Biography

Earl Vickery
Principal, Applied Technology Specialists, Inc., Bixby, Oklahoma

I spent 23 years as a process engineer and manager in the semiconductor industry. In 1989 while a Member of the Technical Staff at the Hewlett Packard Company, I developed the Guardian Gas Protection System that has been used through the world. I then founded On Demand Environmental Systems and Applied Technology Specialists to design and manufacture air and process gas abatement systems. I have also been a technical resource over the last ten years for several law firms working on cases involving abatement technology and equipment.

SESHA 2009 Symposium Abstract

PFC ABATEMENT IN THE SEMICONDUCTOR INDUSTRY,2009

Van Gompel, Joe
(Austin, TX)

Semiconductor manufacturing uses fluorine-based chemistries for both etch processes as well as for many deposition steps because the resulting inorganic fluorides are volatile and readily removed under vacuum. Perfluorinated gases (PFCs; CF4, C2F6, SF6, etc.), decomposed in a plasma, are routinely used as sources of fluorine atoms because they are relatively nontoxic and are available in sufficient purity and bulk at reasonable prices. Consumption of these gases in the process is poor – as low as 15% for CF4 – so much of the gas going into the chamber is exhausted. PFCs are very potent global warming gases and, as they are chemically stable, persist in the atmosphere for thousands of years. This is of great concern for their effects on climate change. The semiconductor industry has long acknowledged this concern, and technologies for abating PFCs have been developed. This is increasingly important as various governmental regulatory agencies are developing legislation to require reporting of PFC usage or even PFC emissions control in some cases. This paper will include a brief overview of PFC usage in semiconductor manufacturing processes, followed by a tour of scrubber technologies that are capable of abating PFC gases. These include fuel-fired combustion, plasma destruction, and PFC-specific catalytic destruction. Attention will also be given to the appropriateness of these technologies for the various semiconductor manufacturing processes.

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SESHA 2009 Speaker Biography

Joe Van Gompel
President, Austin, TX

Joe Van Gompel is the President and Founder of Glade Consulting, LLC, focusing on subfab operations, safety training, and climate change in the semiconductor industry. Joe has a BS in Chemistry from Carroll College in Wisconsin and a Ph.D. in Chemistry from the University of Illinois. Previously, Joe spent 12 years as a point-of-use exhaust gas management specialist for (BOC) Edwards, where he was the primary technical specialist for Edwards’ POU scrubbers in the US. While there, Joe had final approval of scrubbers on new processes, ensuring proper configurations based on safety while optimizing for uptime and cost of ownership. In addition, Joe wrote and presented technical papers and seminars at conferences and was the technical liaison between the fab and the company. Prior to Edwards, Joe spent 5 years as an applications chemist at Mattson Instruments, an FTIR supplier subsequently purchased by Thermo. Joe is active with SESHA and is a member of the American Chemical Society.

SESHA 2009 Symposium Abstract

Conducting a Greenhouse Gas Emissions Inventory: A Primer

Cotter, David
(Capaccio Environmental Engineering, Inc.)

Conducting a Greenhouse Gas Emissions Inventory: A Primer David M. Cotter Capaccio Environmental Engineering, Inc. Concern over the effects of global warming and the movement by international, federal, and state agencies to implement rules designed to track, curtail, and control emissions of green house gases (GHG) has produced a groundswell of action at corporate levels. Additionally, the semiconductor industry is seeing increased pressure from customers and investors to disclose emissions and actions pertaining to global warming, including the Global Reporting Initiative (GRI), the Carbon Disclosure Project (CDP), and the Electronic Industry Citizenship Coalition (EICC). This concern has brought forth a need for the semiconductor industry to better understand how their actions, operations, and tools may contribute to global warming, particular as they relate to the generation of GHG emissions. This paper discusses the drivers behind this movement and the protocols available for corporations to design and implement GHG inventories and reporting strategies. Specific guidance is provided outlining how semiconductor manufacturers and related industries can identify sources of GHG emissions for estimation and tracking, identifying some of the tools and approaches that can be used to accomplish this, and discussing the types of metrics that can be used to track and report progress towards established GHG reduction targets. The general protocol, “A Corporate Accounting and Reporting Standard”, jointly published by the World Business Council for Sustainable Development (WBCSD) and the World Resources Institute (WRI) [WRI, 2004] is part of a series of high level protocols designed to guide corporations in doing emission inventories, establishing reduction targets and strategies, and initiating programs to track and report progress towards those targets. This general protocol has spawned sector-specific guidance documents for the semiconductor industry, such as the World Semiconductor Council (WSC) protocols, which are presented with a focus on case-study application examples.

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SESHA 2009 Speaker Biography

David M. Cotter
Senior Environmental Engineer, Capaccio Environmental Engineering, Inc.

Mr. Cotter is a senior environmental engineer at Capaccio Environmental Engineering, Inc located in Marlborough, Massachusetts. He holds a Bachelors Degree in Mechanical Engineering from Wentworth Institute of Technology and has worked as an air quality specialist for over twenty years. His experience includes: ambient monitoring, source testing, indoor air quality, air pollution control specification, transportation air modeling, air emissions inventory/auditing, compliance resolution, and air permitting.

SESHA 2009 Symposium Abstract

Reclamation of Water and Hazardous Materials in Silicon Processing

Krygier, Vivien; Berndt, Rolf
(Pall Coporation, East Hills, NY)

RECLAMATION OF WATER AND HAZARDOUS MATERIALS IN SILICON PROCESSING Vivien Krygier Ph.D. and Rolf Berndt Ph.D., Pall Corporation, East Hills, NY The semiconductor and PV industries not only consume an ever-increasing amount of water, solvents and other resources but, as a consequence, they also end up discharging large volumes of wastewater and potentially hazardous waste. In many places, expansion of production is restricted due to limited supply of water and by legal and local restraints. Among the processes requiring large quantities of water and producing significant amounts of wastewater or other contaminated fluids as well as silicon/silica fines are: • Pre-shaping (cutting, squaring, chamfering, surface grinding) of silicon ingots • Wafering (slicing of ingots) • Wafer cleaning • Chemical/Mechanical Polishing (CMP) • Silicon Backgrinding and Dicing Silicon/silica fines also appear in the exhaust gas of Czochralski pullers for mc-Si crystal growing. Despite some special features, these processes have a great deal in common. The particles (silicon, silica, silicon carbide) are typically generated or degraded by processes on the surface of workpieces. The majority of these particles are typically less than one micron in size, complicating separation by conventional methods (settling, centrifugation, cake filtration). Chemically enhanced coagulation or flocculation would result in additional contamination of water and adds cost to the reclamation process. A better way is to completely remove the solid particles by means of membranes or other filter media with pore sizes below the particle size. Special dynamic process modes – e.g. crossflow, backflushing/ blowback and air scrubbing – help to maintain the filtrate flow on a reasonable, stable level. The selection of filter media, filter elements, process mode and process parameters and the design of the entire separation system closely depend on the properties and behavior of the dispersion to be purified. Moreover, the architecture of the reclaim process is – aside from the feed specifications – strongly influenced by the technical and economic targets. The particle concentrate generated by the dynamic membrane filtration, for instance, may be further dewatered by cake filtration or centrifugation, sometimes followed by thermal drying, resulting in a powder ready for disposal or re-use. The clear filtrate of a membrane filtration may be used for raw water replacement in DI water plants, for direct reuse with/without polishing or for easier application, e.g. scrubbers. The paper analyses the influence of waste specifications (solids content, particle size, viscosity, temperature etc.) on the selection of technologies, gives a survey on applications, and illustrates details of process design and sizing on the basis of case studies in PV and semiconductor manufacturing.

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SESHA 2009 Speaker Biography

Vivien Krygier
Sr. V.P. Technical Marketing, Microelectronics, Pall Coporation, East Hills, NY

Vivien Krygier is currently Senior Vice President of Microelectronics Marketing at Pall Corporation. She received her Ph.D. from McGill University, Montreal, Canada, in biochemistry. Before joining Pall Corporation, she worked at the Max Planck Institute for Biochemistry in Germany and the Albert Einstein College of Medicine in New York. For over 29 years, she has been involved with the semiconductor industry in various roles at Pall Corporation, including new product development and customer support. She has published several articles in the field. She is currently supporting Pall’s efforts in the photovoltaic arena.