SESHA 2011 Symposium — PDC1

Fundamentals and ESH Challenges of Semiconductor Manufacturing

Susan Creighton

The 2011 Introduction to Semiconductor ESH class is intended for ESH students and professionals new to the semiconductor industry and operations. Topics covered in the class include: • An overview of the semiconductor industry and operations • A virtual tour of a semiconductor fab • An introduction to the semiconductor manufacturing process • A presentation on occupational health and safety issues in a semiconductor fab • A review of semiconductor environmental considerations • Discussions on SEMI EHS Standards: S2, S8 and S23 • A summary of global environmental regulations. An experienced semiconductor EHS professional recognized in their area of expertise presents each topic. This will be a full day PDC. Students will be provided with handouts of each presentation.

SESHA 2011 Symposium — PDC2

Vacuum and Cryogen Safety Concerns for Laboratory Applications

Roger Shrouf

Vacuum systems can present a variety of hazards to the laboratory worker. This course will provide an in-depth discussion of a wide variety of hazards and mitigation techniques related to vacuum systems in a research laboratory environment. A thorough discussion of the interface between the vacuum system and commonly associated pressure sources (such as backfill or process gases) will be provided. The limitations and safety concerns associated with vacuum purging of associated pressure systems will be included. Potential accidental overpressure of the vacuum system will be emphasized as well as safety concerns for the use of brittle materials in vacuum applications. Course discussions will also include ancillary hazards commonly associated with vacuum applications such as vacuum pump issues, electrical safety hazards, and mechanical concerns. Many vacuum processes involve the use of cryogenic fluids – and nearly all cryogenic fluid applications involve the use of vacuum. Therefore, cryogenic fluid properties and hazards as well as mitigation techniques will be discussed. The primary focus of the cryogen safety segment of the course will be on liquid nitrogen and liquid helium applications. A wide variety of hazards will be discussed including the highlighted hazards of pressure build up from the warming of trapped cryogens and asphyxiation concerns. The features and safety concerns of cryogenic liquid Dewars will also be illustrated. Open discussion will be encouraged throughout the course and lessons learned from accident scenarios will be included where applicable.

SESHA 2011 Symposium — PDC3

Silane Safety Professional Development Course

Eugene Ngai

Unpredictable, delayed ignition and explosive are words typically used to describe the behavior of silane. Since 2006 significant attention has been focused on silane safety because of the increasing number of incidents. One day safety seminars and training classes have been conducted around the world by leading experts. Despite these efforts, silane related incidents continue to occur worldwide. Attend this Professional Development Course and you will learn the latest on silane from leading experts. Agenda items include review of the history of silane, how it behaves, insurance/industry funded research projects and their importance of how silane systems can be designed to drastically reduce the number of incidents and/or their severity. A code overview and best practices for silane handling will also be presented. 1:00 – 1:15 Eugene Ngai: Welcome and Introductions 1:15 – 1:45 Eugene Ngai: Review of recent incidents 1:45– 2:30 John Cox and Beth Tshudy: Code Case Study 2:30 – 3:00 Crystal Mjelde: Bulk Installations 3:00 – 3:15 Break 3:15 – 3:45 Sue Creighton: Abatement 3:45 – 4:15 Eugene Ngai: Testing and G13 4:15 – 4:50 Vinnie DeGiorgio: Best Practices 4:50 – 5:00 Closing remarks

SESHA 2011 Symposium — PDC4

Nanoethics: Safety, Risk, and Responsible Innovation

Sarah Davies

This session offers an introduction to contemporary thinking on nanoethics, applying this to the context of the industrial laboratory and opening up a discussion of what constitutes ethical practice in scientific research and development. Throughout, the emphasis will be on the critical skills and tools needed to engage in informal ethical reflection in the workplace. After giving a whirlwind tour of key ideas in nanoethics, the focus will move to ways in which the ‘ethical’ is being used within notions of responsible innovation and corporate social responsibility. The continuum between ‘doing no harm’ and being a ‘positive social force’ will be introduced, with reference to what this continuum will look like in the context of the industrial hygiene and safety professions. Recent research on lay ethical concerns regarding nanotechnology will also be discussed. Finally, the group will engage in a discussion of how ‘nanoethics’ can be practically applied to the professional contexts in which they work. This course is coordinated by Dr Sarah R Davies, of the Center for Nanotechnology in Society at Arizona State University.

Opening Ceremony and Awards Presentation

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2017 Semiconductor Market Update and Forecast

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SESHA 2011 SIA Regional Updates

SIA, ESIA, TSIA, CSIA, KSIA, JSIA

ESIA Update

JSIA Update

KSIA Update

TSIA Update

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SESHA 2011 Symposium Proceedings

Global Semiconductor Industry – Looking Forward

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SESHA 2011 Symposium Abstract

Environmental Regulatory Developments in the EU

Harte, Shane
(ESIA – European Semiconductor Industry Association )

ISESH 2011 / SESHA 33rd Annual ESH Symposium Abstract Title : Environmental Regulatory Developments in the European Union Substance restrictions or substance related bans on use are an obvious point of concern for many sections of the high tech sector. They are however not something new for the worldwide semiconductor manufacturing supply chain. Nevertheless the restriction of substances whether through EU RoHS or REACH systems will continue into the forseeable future. In addition the industry needs to prepare activity and roadmap plans to move away from the exempted substance and applications where possible to do so. This presentation will be broad ranging in nature and aim to update the conference on the regulatory developments in Europe in terms of substances restrictions through REACH, EU RoHS or potentially PFOA and the evolution of potential revised flourinated gas regulations within the EU in 2011 and will assess the impact on semiconductor industries. The presentation will also outline the revised exemption review systems under the revised RoHS directive. Author : Shane Harte EECA-ESIA – European Semiconductor Industry Association 11/13 Rue de la Duchesse, B-1150 Bruxelles, Belgium

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SESHA 2011 Symposium Abstract

JAMP Activity Update

Ibuka, Shigehito
(Tokyo Electron Limited)

JAMP means “Joint Article Management Promotion” council for cross-industry. JAMP frmawork is applicable to chemical/subsatance information transfer through whole supply chain globally, which are required by EU REACH, EU CLP, each country’s GHS, US TSCA or many international/local legslation. JAMP was introduced at the last IHTESH held in Taiwan. Currently, JAMP is introduced in ISO26000 and the draft of ECHA REACH guidance. JAMP activity update should be presented there.

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SESHA 2011 Symposium Abstract

Evaluation of Potential Cytotoxicity of Nanoscale Inorganic Oxides Utilized in Semiconductor Manufacturing

Sierra-Alvarez, Reyes; Otero, Lila; Garcia, Antonia Luna-Velasco, Angel Cobo, Jim A Field , Citlali
(University of Arizona, Tucson)

Authors: Reyes Sierra-Alvarez, Lila Otero, Citlali Garcia, Antonia Luna-Velasco, Angel Cobo, Jim A Field The future success of the semiconductor industry is dependent on the capacity to manufacture smaller and smaller devices which requires the use of nanoparticles (NPs). Numerous reports have been published in recent years expressing concern for the potential toxicity of NPs to humans and ecologically important species. The objective of this work was to investigate the potential cytotoxicity of nanoscale inorganic oxides commonly utilized in semiconductor manufacturing (SiO2, Al2O3, CeO2) and emerging inorganic oxide nanoparticles (HfO2). Other commercially-important inorganic oxides (ZnO, TiO2, ZrO2, Mn2O3) were also included in the study for comparison. Nanotoxicity was assessed using several well-established bioassays (e.g., Microtox, yeast respiration measurements, MTT) and a recently developed impedance-based Real Time Cell Assay (RTCA). The target cells in those bioassays included bacteria, yeast, and human cells. Additional assays were performed to evaluate the potential involvement of reactive oxygen species (ROS), toxic soluble species, and/or decrease in cell membrane integrity on cytotoxicity. Furthermote, the particle size distribution and fraction of inorganic oxide effectively dispersed in the various bioassay media was investigated in order to get information on the actual hydrodynamic diameter and state of dispersion of the nanomaterials. With the exception of SiO2 which formed highly stable dispersions, the nanoscale inorganic oxides tested showed a high tendency to aggregate in most biological media resulting in micron-size aggregates that settled out of the dispersion. ZnO and Mn2O3 were the most inhibitory inorganic oxide nanomaterials evaluated with 50% inhibiting concentrations often in the low ppm range. In contrast, CeO2 and HfO2 were nontoxic in most assays at concentrations as high as 1,000 mg L-1. Nanosized SiO2 and Al2O3 showed intermediate to low cytotoxicity. The underlying mechanisms involved in the cytotoxicity of these nanomaterials are currently under investigation. Furthermore, the results obtained indicated the potential of impedance based RTCA to rapidly screen for nanoparticle toxicity. Future research will address validation of the RTCA results using conventional cytotoxicity tests.

SESHA 2011 Symposium Abstract

Preventing musculoskeletal discomforts for a healthy workplace

Lin, Ro-Ting
(Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan)

Musculoskeletal diseases are on top, accounting for 73%, of the ranking of compensated occupational diseases in 2010 in Taiwan. Previously reported musculoskeletal discomforts among fabrication room (fab) workers were owing to frequent manual wafer pod handling or operating manufacturing equipments with improper anthropometric data for users in different countries. In addition, sufferers of work-related tendinitis are entitled to compensation since 2010 under the new list of occupational diseases in Taiwan, leading to an anticipated soar of work-related musculoskeletal diseases compensation due to long hours of use or repetitive typing among computer users. Providing an ergonomic working interface for a company with hundreds of thousands workers is a challenge to balance the purchase specification and cost. Under the changing working interface from on-site process equipment operation to remote computer monitoring, the report aims to provide an overview of prevalent trends, regulatory standards, and challenges of musculoskeletal disease among different countries. The report demonstrates our systematic approach for reducing workers’ awkward postures and musculoskeletal complaints through ergonomically redesigned fab/office workstations. In addition to statistical data, the report also includes an introduction of health care programs on solving musculoskeletal discomforts, such as massage and traditional Chinese medicine lectures. Information on the effectiveness of ergonomic programs has been computerized and integrated into e-ESH system. Our case studies and experience sharing may be of use in both policy and practice for reducing ergonomics-related occupational diseases and promoting a healthier workplace.

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SESHA 2011 Symposium Abstract

Tetramethylammonium hydroxide (TMAH): Toxicity and Methods to Reduce Risk in the Workplace

DiZio, Kathleen; Melville, Richard ; Timlin, Ernest
(IBM, San Ramon, CA and IBM, Hopewell Junction, NY)

Tetramethylammonium hydroxide (TMAH), CAS #75-59-2, is employed in an increasing number of semiconductor manufacturing processes. Newer applications may use TMAH concentrations as high as 25% at elevated temperatures. Contact with concentrated TMAH solutions may cause serious intoxication. Several fatalities have been reported by the Asia Pacific semiconductor and photoelectric industries. Factors that may be important in determining the degree of intoxication include the concentration of TMAH, the % body surface area affected, the period before decontamination, and the possibility of concurrent inhalation exposure and dermal contact. Early toxicity studies in rats and guinea pigs identified TMAH as highly toxic with an oral LD50 in rats between 34 and 50 mg/kg and a dermal LD50 in guinea pigs of 25 to 50 mg/kg. Later studies in rats sponsored by IBM found that contact with less than 1 milliliter of a 12% or 25% TMAH solution was lethal within 3 hours. IBM investigated possible underlying mechanisms of acute systemic toxicity including the direct effects on neurotransmission and on blood gases. IBM took prompt action to assess and, where necessary, enhance the health and safety procedures associated with TMAH based on the results of these animal studies. IBM notified the US EPA under the significant new information provisions of the Toxic Substances Control Act, Section 8e. Furthermore, IBM modified internal chemical labels for formulations containing TMAH, sponsored chemical-resistant glove and coverall permeation testing on TMAH solutions, performed process reviews on specific TMAH-using operations, and notified employees and contractors of the potential hazard. IBM implemented vigorous controls on the introduction of new processes employing concentrated TMAH solutions. Senior management is briefed on the potential hazards of the process, the tool and engineering requirements, and the availability of potential alternatives to TMAH. IBM develops work plans to reduce or eliminate potential TMAH hazards. In addition, IBM is working in cooperation with several development partners and suppliers to identify less hazardous alternatives to TMAH.

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SESHA 2011 Symposium Abstract

The Integration of a Toxic Gas Monitoring System into the Building Fire Alarm System

Sweeney, John
(Harvard University)

Many facilities have toxic gas monitoring systems (TGMS) with local strobes to evacuate just clean rooms and affiliated areas. However, many facilities do not integrate their toxic gas monitoring systems into the building fire alarms systems. This presentation will describe three different types of toxic gas monitoring systems in a university setting and will describe how all three systems are integrated into the perspective building fire alarm systems. Topics of interest in this presentation will be as follows: 1. Details on TGMS Alarm level set points for exhaust and ambient gas sensors and when they trigger the building fire alarm systems. 2. Overview of how the two systems are integrated 3. Reasons for integrating the two systems 4. Training details for all personnel involved in this new integrated system. In a university setting, the various working groups involved during emergencies are more expansive than in an industry setting. Types of people trained on the system (campus police, local fire fighters, facilities personnel, university operations center (24/7 hotline), EH&S department responders, building occupants etc).

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SESHA 2011 Symposium Abstract

Compliance Techniques for new Greenhouse Gas Regulations

Higgs, Tim
(Intel, Chandler, AZ)

New greenhouse gas regulations pertaining to emissions reporting and facility permitting will impose multiple new requirements on semiconductor manufacturers and others in the electronics industries. The mandatory reporting rule for additional sources of fluorinated greenhouse gases (40CFR Part 98, subpart I) will require new approaches for measuring emissions, tracking inventories of fluorinated gases and heat transfer fluids, and add extensive new recordkeeping and reporting requirements. The Prevention of Significant Deterioration and Title V Greenhouse Gas Tailoring Rule (40CFR Parts 51, 52, 70 et. al.) will subject many sources to major source permitting requirements that have previously been able to avoid such requirements. These sources are likely to experience greatly increased requirements to understand and manage emissions impacts of routine changes, and significantly increased monitoring, reporting and recordkeeping burden. This presentation will examine compliance techniques for meeting the new requirements, and possible approaches for reducing the burden.

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SESHA 2011 Symposium Abstract

PFC Stack Emissions Testing

Inloes, Scott
(WaferTech, Camas WA)

The goal of this testing was to determine if stack testing could be used to replace recipe specific testing required in the federal reporting rule. During February of 2011, the SIA stack testing subcommittee developed the various stack testing options for testing emissions from electronic manufacturing Fabs. Various test methods were considered with the criteria determined to be 1-10 ppb detection level . This equated to Fab emission of 1,000 to 40,000 MT CO2 eq depending on the Fab’s exhaust rate. Our site used GM/MS method to determine the concentrations of PFC’s and collection the samples using Summa containers. This method requires one-two days of onsite sample collection by a local emission testing company. Our process PFC emissions are routed to five acid scrubber stacks. In April of 2011, we tested the five acid scrubbers simultaneously to reduce any variability of the site wide data. During the collection of the samples daily PFC gas usage data was collected and tier 2 emissions were compared to stack test results. The daily rate was also compared to the prior year’s usage rate to determine if the test was representative of the annual usage rate. The GC/MS analyst was done at a remote certified lab with additional QC procedures to validate the method. The testing included duplicate samples, blanks, ambient samples, and spiked samples. These samples are also part of a stability study. The laboratory results demonstrate that the samples are accurate, stable and reproducible. The process data indicates that the tests were done while the plant was operating a 90-110% of the annual PFC gas usage rate compared to the prior year. Part of the cost of the study was paid for by ISMI.

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SESHA 2011 Symposium Abstract

Developing a Fluorinated Greenhouse Gas Stack Testing Method Using FTIR

Gilliland, Tina; Laush, Curtis
(Texas Instruments, Inc. and IMACC)

Texas Instruments Incorporated (TI) is interested in identifying an alternative method to more accurately estimate Greenhouse Gas (GHG) emissions from their semiconductor fabrication operations(fabs) to reduce the cost burden of the final Mandatory Reporting Rule, Subpart I (40CFR98). In order to accomplishment this goal, TI proposes estimating emissions using a facility wide mass balance approach based on emissions characterization using familiar analytical equipment such as the Fourier Transform InfraRed mass spectrometer (FTIR) and production metrics. Historical data using FTIR at the end of line exhaust stacks indicated that many of the process greenhouse gas (GHG) concentrations were below typical FTIR detection limits of 50 parts per billion by volume (ppbv). IMACC, a company that specializes in designing and manufacture of FTIR monitoring systems for industry and government, understood the challenges of measuring these compounds at sub-ppbv levels and performed experiments in their lab with a modified FTIR to achieve lower detection limits. The primary objective of this study was to measure in the field exhaust stacks at a typical operating semiconductor fab to demonstrate the feasibility of measuring GHGs at sub-ppbv. IMACC, using their enhanced FTIR and approved EPA Methods 301 and 320, successfully measured stack level emissions at three TI fabs with detection limits in the parts per trillion by volume (pptv), thus demonstrating the feasibility at both 200mm and 300mm semiconductor fabs. The second objective of this study was to reasonably correlate the semiconductor fab operational parameters with measurements at the exhaust stack. The field data is currently being evaluated and the non-confidential information available will be shared for this presentation. Members of the semiconductor industry desire to use this stack testing methodology to develop facility wide emissions factors for each GHG so that semiconductor fab GHG emissions can be estimated in a more accurate and cost effective manner.

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SESHA 2011 Symposium Abstract

Title: Staying up to date with the EPA’s Mandatory Reporting for Greenhouse Gases and California’s AB32- Regulations as they relate to Semiconductor and Related Devices.

Cook, Jeremy
(EORM, San Jose CA)

Description: This talk will provide an overview of the EPA and the California Air Resources Board (CARB) GHG regulations as they relate to the Semiconductor, LCD and PV manufacturing industries. The presentation will provide a brief regulatory update on significant international, national and state issues concerning climate change and highlight specific best practices, tools, strategies and lessons learned following the March 1, 2011 CARB compliance deadline. The presentation will conclude with a brief look forward on what the future may hold for GHG management in the technology sector.

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SESHA 2011 Symposium Abstract

Decontamination and decommissioning of equipment: Roundtable Discssion

Yeakley, Tim
(Texas Instruments)

Semiconductor manufacturing and research facilities regularly ship equipment parts for rebuild or repair. These parts could contain chemical and byproducts residues that cannot be removed on-site without causing irreversible damage to the part. The presence of these residues may also require compliance with various regulations during transport from DOT, IATA, IMDG, etc. The purpose of this roundtable discussion is to share information between semiconductor companies on the best known methods to classify these parts for transportation. We will discuss how to determine whether decontamination of a specific part onsite is appropriate; the de-minimus quantities above which the part will have to be regulated; methods used to determine the hazards of byproducts in parts; necessity of testing the byproducts; whether regulatory tests can be modified for practical application; and methods for managing special cases like batteries and magnets.

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Keynote Presentation: Ic Insights

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SESHA 2011 Symposium Abstract

Safety and Health Committee

qiao, xinyu; wang, xiaoting
(Hynix Semiconductor (China) Ltd.)

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Hynix semiconductor China Limited (HSCL), headquartered in Icheon, South Korea, is a wholly foreign-owned enterprise located in Export Processing Zone Wuxi, Jiangsu province of China. HSCL’s main product is 12-inches wafer, and it covers an area of 54 million square meters, of which the gross Investment reaches to 5.26 billion dollars. About 3700 employees from Korea and China work for HSCL.Safety and Health Committee Safety and Health committee is a communication bridge between employee and employer, created by Hynix and Hynix labor union together for the purpose of promoting mutual understanding between the labor and the capital, dissolving and improving internal issues of environmental, health and safety related to employees, making the optimal working environment for employees. Specificity 1. Specialty As far as the organization structure is concerned, Safety and Health committee is a newborn thing. Similar organization structure has not been found by now in other related industry. 2. Innovation In a point of view of foreign labor unions’ operating mode, there is a sharp contradiction in terms of interests between labor union and enterprises. But the Hynix labor union is designed to protect and coordinate the interests of both sides of labor and capital, satisfy the employees and promote the enterprise development as well. Operation Overview 1.Organization Chairman of a committee ：Chinese labor union chairman, Korean deputy general manager Committee member：Korean leaders from manufacturing department, technology department, general affairs department, and personnel labor union committee Executive:Responsible persons from ESH department 2.Operation Mode: Practical meeting: We collect advice and suggestions monthly from the basic level by various means and hold the practice meeting to take them over in the end/beginning of a month. Solutions will be taken out and significant issues would be submitted to periodic meeting for further discussion.Periodic meeting:Periodic meeting is held quarterly to debrief the results of practical meeting and provide advice and solutions to significant issues. 3.Operation Content: Safety: Clean room odor, PPE, toxic gas monitoring Environment: Dorm odor, corporate environment, sewage treatment Occupational health: noise, psychological consult, smoking and drinking, individual radiation dosimeter 4.Operation results Safety and Health Committee has collected and disposed more than 200 advice and suggestions from 2008. Our operating environment and the safety consciousness of workers has been greatly improved. And the sense of trust between labor and capital has been enhanced a lot as well. As a result, our employees put more energy into production, makes more output and profit. In 2010, We Hynix got the historically highest profits.

SESHA 2011 Symposium Abstract

A Study On Odor Reduction for Semiconductor Industry

Park, No Hyeok; Kim, Sung Gon; Shin, Chong Su
(1,55,125 Hyangjeong-dong Hungduk-gu Cheongju 361-725 Repulic of Korea)

A Study On Odor Reduction for Semiconductor Industry No-Hyeok Park, Sung-Gon Kim, Chong-Su Shin Cheong-Ju ESH Team, Administrtion Division, Hynix Semiconductor Inc. 1,55,125 Hyangjeong-dong Hungduk-gu Cheongju 361-725 Repulic of Korea Tel : 82-43-280-2615, Fax : 82-43-280-2489, E-mail : nohyuck.park@hynix.com Odor is caused by one or more volatilized chemical compounds that human being can perceive by the sense of olfaction and can feel unpleasant and disgusted. It is one kind of sensory pollution that results in physical and psychological harm. Especially, semiconductor industry have had difficulty in managing unclear odor as air pollutants generated by many kinds of gasesous chemical compounds and considering reduction measures. Hynix Semiconductor Inc. judged that odor problems will be issued by residents because the residential areas have been created close to Cheongju site. Therefore, our company put technical measures to practical use for odor management generated from semiconductor plant. In first step, the correlation between the concentration of exit specific compounds(e.g. HF, NH3) and the odor was considered for selecting odor index. The complex odors in itself were selected for the optimal management index. In second step, reduction characterisitics by emission sources for the practical use of odor reduction were studied. Especially, the exhaust part of the thin film process had the highest odor concentration based on the result derived from the priority for the classification of the emission odors. A wet scrubber in installed to treat the odor intensively between the plasma scrubber to decompose PFC gas at high temperature and the final wet scrubber. Also, the odor removal efficiency of Hume generated from SC-1 wastewater(Mixed of NH4OH and H2O2) improved with building the wet scrubber (H2SO4 neutralization) for NH3. Its process is seperated from existing wet scrubber(NaOH neutralization) for acid. Hynix Semiconductor Inc. was able to decrease about 70% of complex odors in 2010 compared to 2009 with the odor reduction technologies as state above. Odor monitoring systems for odor quality analysis and real-time management are being currently investigated. This research introduces our company’s odor reduction control system for win-win strategy between the semiconductor industries and the nearby residents.

SESHA 2011 Symposium Abstract

The Business Case for Integrating ESG

Niekerk, Gary ; Fallender, Suzanne; Zeller, Elisabeth
(Intel Corporation, Santa Clara, CA)

ESG (Environmental, Social and Governance) performance indicators and metrics have been used for several years by socially minded investors to make investment decisions; however, companies have had a difficult time applying similar metrics for internal business decisions that go beyond traditional ROI. Intel developed a framework to review our environmental, social and governance activities and practices in terms of their impact along four main business dimensions: (1) Risk Management: Protecting our license to operate, maintaining constructive relationships with local communities, and mitigating risk and promoting responsibility throughout our supply chain; (2) Operations: Building a strong talent pipeline, increasing employee engagement, and achieving cost savings and greater efficiency through sustainable business practices; (3) Revenue: Contributing to growth and product innovation; and (4) Brand: Enhancing our reputation and goodwill with stakeholders and becoming a trusted partner. This framework provides Intel a method of evaluating and describing the various ways in which our integrated approach to ESG factors creates value for Intel; by making decisions that optimize long-term shareholder value and effectively articulate internal and external value generated from our activities.

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SESHA 2011 Symposium Abstract

Implementation Strategy for Corporate Social Responsibility (CSR) at ON Semiconductor

Evans, Keenan; McCarley, Theresa; Amorin, Pam
(ON Semiconductor)

Implementation Strategy for Corporate Social Responsibility (CSR) at ON Semiconductor Keenan Evans, Theresa McCarley and Pam Amorin ON Semiconductor 5005 E. McDowell Rd. Phoenix, AZ 85008 The term Corporate Social Responsibility (CSR) encompasses corporate governance, environmental due diligence and sustainability, worker rights, and health and safety considerations. In response to the social needs and desires driven by company stakeholders (shareholders, customers, employees and the local communities where companies do business), there has been a surge of CSR activity in all aspects of business (manufacturing, services, etc.). This activity requires companies to formally demonstrate they are good global corporate citizens wherever they do business. In order to align with the global electronics community and to formalize and organize our various CSR efforts, On Semiconductor became an applicant member of the Electronic Industry Citizenship Coalition (EICC) in mid-2009 and we became a full member of the EICC in December of 2010. We had previously endorsed the EICC code of conduct and we had a number of programs already in place to ensure compliance to the various tenets of the code, including a long established code of business conduct and formal certification to the ISO14001 environmental management system standard. This presentation/discussion will explore our ‘current state’ of CSR globally and focus on our implementation and management strategy internally within our own facilities and externally with our supply chain. The presentation/discussion will incorporate an overview on the impact of recent legislation regarding conflict metals and human rights.

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SESHA 2011 Symposium Abstract

SF6 Massive-Scale Decomposition Technology and Clean Development Mechanism Project in TFT-LCD Industry, South Korea.

Choi, Junghyun
(KDIA)

South Korean LCD industry has been investing new generation LCD fab since early 2000s, thus it has the line up from 2nd generation to 8th generation of LCD fab. As production expanded, greenhouse gas emission also has been increased. Within the greenhouse gas, SF6 gas is the major gas, which is used as an etching agent in dry etching process and its global warming potential is over 20,000 times higher than CO2. SF6 abatement technology was already developed, which can treat about 1 cubic meter of exhaust per minute. However, as the LCD generation increasing, the amount of process exhaust has been increasing sharply. In this circumstance, to abate SF6 gas, several small-scaled abatements should be installed in point-of-use (POU), i.e. right after each process chamber of dry etchers. Thus, there are two major problems for SF6 abatement; firstly, decomposition efficiency is difficult to be verified, secondly, huge area is needed to install enormous POU type scrubbers. To solve these obstacles, Korean LCD industry has started to develop a massive-scale decomposition facility by itself since 2005. However, the technology development was quite risky, because of 3 reasons as bellows; 1) Static pressure in dry etchers should be secured. 2) Various acidic and corrosive substances from dry etching processes should be treated before SF6 gas decomposing unit. 3) In SF6 gas decomposing unit, SF6 gas should be destructed more than 90% steadily. 4) HF and other by-products, which comes from SF6 gas decomposing, should be treated after SF6 gas decomposing unit. In order to hedge these risks, Korean LCD industry utilized CDM projects, for hiring enhanced technology and funding investment. As a result of various actions, new CDM methodology approved as AM0078 by UNFCCC in February 2009, the massive-scale decomposition facilities were developed and installed in 2009, and finally SF6 decomposition in LCD industry CDM projects were registered in UNFCCC. The developed facilities are able to decompose more than 90% of SF6 gas steadily and the capacity is 40 times larger than conventional abatement facility.

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SESHA 2011 Symposium Abstract

PV Industry – Overview of EHS Considerations

Cyrs, William; Krause, Kerry; McIntyre, Andrew*
(Environmental & Occupational Risk Management, Inc. (EORM))

Gallium arsenide (Ga-As) thin film photovoltaic (PV) cells have shown promise for large-scale commercial production, with conversion efficiencies reaching as high as 40.7% using concentrators. Objective: The purpose of this study is to present an analysis of the human health risks throughout the life cycle of a Ga-As thin film PV cell. Methods: A comprehensive analysis of the literature was performed, with critical points of human health risk identified throughout the lifecycle of Ga-As thin film PV cells. In addition, process information for the obtainment of raw materials, manufacture of PV cells, module assembly, installation, and commercial deployment were analyzed in order to further refine the risk characterization by describing exposure potential to hazardous substances. Where data was unavailable for Ga-As-based PV cells, available information from other thin film PV cell types was applied. Results: The manufacture of PV cells is a key point of risk during the life cycle of Ga-As thin film PV cells, due to the use of process chemicals such as highly toxic metal hydride gases (e.g., arsine) and pyrophoric metal-organics (e.g., trimethyl indium) as feedstock materials. On the other hand, the incorporation of PV cells into modules provides little opportunity for exposure; thus risk becomes minimal. In this study, measures used to control exposure to potentially hazardous materials are discussed, with a focus on engineering controls. Conclusions: From this assessment, it is clear that although unique occupational hazards exist for the different life stages of Ga-As thin film PV cells, experience from the development of other PV cell types, as well as a precautionary approach, are being used to minimize the associated risks. The results of this study provide data necessary for regulatory compliance with a number of international regulations such as REACH and companion product safety requirements.

SESHA 2011 Symposium Abstract

How to improve the LED ESH issues and GHG emission reduction in Taiwan

Cheng, Ju-Hsiu ; LU, Joey; Peng, Yu-Chih
(TOSIA)

LED light bulbs are also part of the solution to the energy crisis we are facing. LED light bulbs use less power up front and generate less heat. Replacing all of lighting with LED lighting will suddenly reduce electrical usage and also reduce CO2 emissions from power plants. Because LED lights are very efficient when compared to other lighting products. It is a good choice for energy saving and reducing climate change. It is why this industry grows up quickly in the past decade in the world. LED manufacture is similar to the semiconductor industry; they use a lot of chemical and energy. LED Fab emitting air pollutant, producing waste, make waste water and toxic substance etc. These pollutants and GHG emission is different from semiconductor industry. Taiwan LED industry association is the only LED industry organization in the world. This association set a ESH committee and supported by ITRI. This article will show that the information of GHG emission and how to improve the ESH issues in LED industry.

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SESHA 2011 Symposium Abstract

Sustainable Energy Solutions Through Product Life Cycle Management

Sinha, Parikhit (Ricky)
(First Solar, Tempe, AZ)

At least 89% of the emissions associated with electricity generation could be prevented if electricity from photovoltaics (PV) displaces electricity from the grid. (Fthenakis, et al., 2008). The development and implementation of such renewable energy technologies are critical to helping achieve a low-carbon economy. However, to ensure the long-term sustainability of the solar industry, it is critical that environmental impacts be addressed at all stages of the product’s life cycle – from raw material sourcing, manufacturing, installation, operation and end-of-life disposal and recycling. This presentation will provide insight and lessons learned from First Solar’s life cycle management approach and it’s leading-edge efforts to implement a comprehensive environmental plan. Given the significant growth of the CdTe PV technology and its rapid deployment in the field it is critical that environmental impact data continue to be collected, analyzed, made public, and updated. In this presentation First Solar will provide an overview of its experiences and best practices in developing large-scale PV projects, including detailing the benefits and impacts of utility-scale PV projects on a life cycle basis. By the end of 2010, a total of more than 30GW of PV capacity will have been installed world-wide, and what happens to these products at the end of their useful life needs to be addressed. With a commitment to extended producer responsibility, First Solar, a leading manufacturer and developer of large scale projects, has implemented a comprehensive pre-funded module collection and recycling program. This presentation will provide details on how the overall program is designed to be convenient, unconditional, and free. First Solar will also share updated information on the recycling technology it has developed and implemented on a commercial scale ensuring that substantially all module components (by mass) are recovered for reuse in new solar modules or new glass products. By offering a collection and recycling program, the largest CdTe PV manufacturer is proving today that it is possible to manage waste concerns for the future while creating truly sustainable energy solutions today.

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SESHA 2011 Symposium Abstract

GHG Reporting for the Electronics Industry – Determination of Reporting Applicability

Cotter, PE, David
(Capaccio Environmental Engineering, Inc., Marlborough, MA)

Mr. Cotter will present a review of the U.S. EPA’s recently promulgated greenhouse gas (GHG) reporting rule for the electronics manufacturing industry (40 CFR Part 98, Subpart I). The presentation will include a review of the rule’s applicability criteria and how to use the equations in the regulation to determine applicability. The presentation will also discuss the rule’s requirements for monitoring, reporting, and record keeping, including the requirement to develop a written GHG monitoring plan by April 1, 2011.

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SESHA 2011 Symposium Abstract

Point -of -Use ammonium compounds removal – keeping exhaust emission clear

Tsou, Albu

Abstract – Many wafer fabs face the challenge of managing effluent generated from compound semiconductor process-specific and that includes ensuring Point-of-use (POU) abatement devices meets the required or desired performance. For POU abatement systems, we usually focus on the main electric/fuel oxidation abatement mechanism but not on wet scrubbing section. It was found that poor abatement efficiencies of wet scrubbing could lead to environmental issues such as generation of fine particle at the stack and corrosion of exhaust duct. Those fine particles from exhaust duct is made of unabated completely ammonia (NH3) and hydrogen fluoride (HF) combination . We evaluated the NH3 and HF abatement efficiency in two major types of POU abatement systems by comparing fluoride ion concentration and pH in the water supply tank. Based on the study, water quality and pH affect the abatement efficiency of water-soluble gases significantly, especially for tools that are running high nitrite or chamber clean recipes. By introducing fresh water supply method and optimized pH adjustment on the wet scrubber sections, we are able to improve POU abatement efficiency significantly and eliminate the environmental issue of fine particles generation at the stacks.

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SESHA 2011 Symposium Abstract

The cooperation to reduce SF6 emission between the electricity and Magnesium industries

LU, Joey
(Rm. 113, Bldg. 64, 195 Chung Hsing Rd., Sec.4 Chu Tung, Hsin Chu, Taiwan 31040, R.O.C.)

The bulk of Taiwan’s SF6 emissions come from the optoelectronics, semiconductor, power generation, and magnesium industries. Since the EPA signed SF6 voluntary reduction memorandums with Taiwan’s optoelectronics and semiconductor industry associations there has been an estimated reduction in emissions in carbon dioxide equivalent (CO2e) of24 million tonnes. As for the electricity generation industry, their emissions of SF6 come mainly from leakages arising from the insulation of high-voltage facilities. As a result, since 2006 the EPA has been actively promoting the recycling of SF6 from the electricity generation industry and in 2009 completed R&D into purification and reuse technology for this type of SF6. Testing has shown that when the water and impurities are removed and the waste SF6 is purified in the correct manner then it can be used directly by the magnesium industry, which is of great benefit in reducing Taiwan’s emissions of this greenhouse gas. This article will introduce how to reduce SF6 cooperation between the electricity and Magnesium industries

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SESHA 2011 Symposium Abstract

Lessons Learned From Measuring Destruction or Removal Efficiencies (DRE) of Fluorinated Greenhouse Gases Across Point-of-Use Abatement Devices

Benaway*, Bryan J; Hall, Steven E
(URS Corporation, Austin, TX)

This presentation discusses the various lessons learned and challenges faced for properly measuring DRE for fluorinated greenhouse gases across various POU abatement devices. Although emphasis is for performing these studies in accordance to the EPA “Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing”, several variations to portions of this methodology have been found to be reliable and cost-effective and will also be discussed. Results and lessons learned from a particular study involving a through silicon via (TSV) tool process coupled to a burn/wet POU abatement system will be covered as well as other challenges faced during this type of testing.

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SESHA 2011 Symposium Abstract

DRE Measurement of POU Scrubber through Applying the Dilution Factor of PFCs

Oh, Chnag Hyun; Ko, Seung Jong; Jeong, Yun Yeong
(ESH R&D Center, Hynix Semiconductor Inc, icheon-si)

The Korean semiconductor industry makes progress various PFCs (Perfluorocompounds) reduction activities such as optimizing processes, switching to alternative gases and installing abatement system. Study on correct measurement of PFCs emission is also followed at the same time. This study was performed as first assignment to evaluate NF3 gas in Hynix semiconductor. We measured DRE (Destruction Removal Efficiency) on-site of NF3 gas from POU (Point of Use) scrubber through applying the EPA (Environmental Protection Agency) protocol (EPA 430-R-10-003, 2010). We applied method 2b which keeps process variables “unaffected” and drives measurement normally. It is applied to measure plasma-wet type POU scrubber. We used two FT-IR (Fourier Transform Infrared), a QMS (Quadrupole Mass Spectrometer) for measurement and measured the gas flow and DRE with He gas as a tracer. DRE of NF3 gas from two chambers of CVD (Chemical Vapor Deposition) cleaning process was measured and the results showed more than 90% efficiency and less than 5% relative error as well. Based on this study results, we will proceed to calculate the exact GHG emission with continuous carrying out DRE measurement of another PFCs such as CF4, C2F6 and C3F8. Key Words : PFCs, DRE, POU Scrubber, Plasma-Wet, FT-IR

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SESHA 2011 Symposium Abstract

Comparison Study of Fourier Transform Infrared (FTIR) and Quadrupole Mass Spectroscopy (QMS) for Point-of-Use (POU) Abatement System Effluent Flow Determination

Hall*, Steven E. ; Benaway, Bryan
(URS Corporation, Austin, TX)

The recently published “Environmental Protection Agency (EPA) Protocol for Measuring Destruction or Removal Efficiency (DRE) of Fluorinated Greenhouse Gas Abatement Equipment in Electronics Manufacturing, Version 1”, March 2010 (EPA Protocol) requires the use of quadrupole mass spectroscopy (QMS) for determination of the total volumetric flow (TVF) of POU abatement device effluents. This study directly compares an alternative approach using Fourier transform infrared (FTIR) spectroscopy to the required QMS method. Since the EPA Protocol also requires usage of FTIR for emissions characterization, its use for flow determination will provide significant cost savings. A study was performed by URS Corporation in conjunction with International SEMATECH Manufacturing Initiative and Sherer Consulting Services where three POU abatement systems were tested during normal operation. Two of the POU abatement systems were fuel-based thermal oxidation/wet scrubbing systems (burn/wet) and one POU abatement system was an electric heat oxidation/wet scrubbing system (electric heat/wet). Determination of TVF by QMS was performed in strict accordance to EPA Protocol and the FTIR determination of TVF strictly followed the pertinent sections of the 2009 ISMI Guideline for Environmental Characterization of Semiconductor Process Equipment – Revision 2 (2009 ISMI Guideline).

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SESHA 2011 Symposium Abstract

Air Permitting Wafer Fabs

Sherer, Mike
(Sherer Consulting Services, Inc., Gilbert, Arizona)

Semiconductor fabs have complex processes that emit numerous process gases and byproducts. This presentation will provide information on developing calculation methodologies for air permitting, including byproducts. Strategies for air permitting will also be presented.

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SESHA 2011 Symposium Abstract

Complying with 1-Hour NO2 NAAQS

Davis, Brett
(Zephyr Environmental Corp., Austin, TX)

The US EPA has recently promulgated a totally new short term National Ambient Air Quality Standard (NAAQS) for NO2. This 1-hour standard became effective April 12, 2010 and is set at 100 parts per billion (ppb) or 188 micrograms per cubic meter (μg/m3). For premit activity to authorize new or modified combustion sources, site wide modeling to demonstrate compliance with the 1-hour NO2 NAAQS is likely to be required. The presentation will inform the audience that non-compliance is common, often due to emissions from emergency engines. Techniques for modifying sources and operations to improve modeling results will be detailed.

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SESHA 2011 Symposium Abstract

Implementing ISO 13849-1; An Equipment Manufacture\\\’s Perspective

Fessler, Mark
(Tokyo Electron U.S. Holdings, Inc.; Chandler, AZ)

Performance Level’s: Why Now? Current semiconductor equipment design standards already reference ISO 13849-1, but not many engineering teams have taken the leap to implement yet. Currently both EN 954-1 (1996) and ISO 13849-1 (2006) can be used by the equipment builders, users and integrators to help prove their presumption of conformity to the Machinery Directive (2006/42/EC). It’s important for us remember that after Dec 31st, 2011, only EN ISO 13849-1(2008) may be used for this purpose. There are different arguments being made on when we should implement. The proponents of the standard say that protective measures have evolved to keep pace with the increasing automation complexity, and that customer’s want to future proof their machines. Additionally, it is specifically mentioned multiple places within two semiconductor specific design guides (EN 60204-33, Section 9 and SEMI S2 Sections 11, 12, and RI 13. The “naysayers” say that its overkill and not needed, as our equipment leads the world in safe design/manufacturing. Additionally, both the Machinery Directive and SEMI S2 guideline allows for a risk based approach which permits certification without following this specific harmonized standard (e.g conforms to performance goal versus conforms to stated criteria). It has also been viewed as being overly-complicated (fear factor to undertake). TEL U.S’s. Product EHS embarked on task of applying ISO 13849-1 to one of our new equipment’s design within a US-based TEL Engineering Group, and its will be evaluated as a learning tool for other TEL Engineering groups in Japan. Roadblocks and lessons learned will be shared.

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SESHA 2011 Symposium Abstract

Fire Safety Compliance – Why Are My Fire Safety Systems Not SEMI S2 Compliant?

Wyman, Matt
(KFPI, Dallas, TX)

Fire Protection Safety & Compliance is clearly defined by SEMI S2 in Chapter 14. In fact, Chapter 14 encompasses over 4 pages of the SEMI S2 document to detail “Fire Risk Assessment”, “Fire Risk Reduction”, “Fire Detection”, and “Fire Suppression” design and compliance. Also, SEMI S14 is another entire SEMI document dedicated to Fire Risk Assessment & Mitigation. However, when it comes to actual fire protection system integration into semiconductor equipment, it appears that no one actually reviews to make sure the fire safety system is compliant. KFPI has performed numerous 3rd Party inspections and audits of existing semiconductor equipment fire protection systems installed worldwide. KFPI will uncover the numerous fire protection non-compliance issues they have discovered in fabs around the world, many of which were supplied by the tool manufacturer. We will then explain the resulting fire safety hazard for each violation found. Issues include inadequate design, lack of supervision, improper application, improper installation, and imitation equipment.

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SESHA 2011 Symposium Abstract

Around the world chemical tour

Graunke, Dawn; Majors, Mary 
(author)

Several countries, including the US, are reviewing their chemical strategies, taking a close look at EU REACH. Could this mean harmonized global chemical regulaitons? Harmonizing chemical legislation in all countries would be extremely complicated because of variations in government structures. This presentation will take a tour of current and pending chemical regulations around the globe with a focus on potential impacts to the supply chain, importer requirements, and what it takes to import/export a chemical around the world

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SESHA 2011 Symposium Abstract

Recovering Semiconductor Manufacturing Materials

Parker, Reg; Atkinson, Bob; Bradshaw, Jeff
(Freescale Semiconductor)

Recovering Semiconductor Manufacturing Materials Semiconductor Scrap Management Program Objectives  Environmental Stewardship  Intellectual Property Protection  Maximization of potential revenues How to accomplish these objectives  Follow established internal corporate policies for reclaim  Contracting with reclaim/recycler (s) that understands complex semiconductor scrap materials.  Final scrap recovery through Integrated Smelter process. Structure of the Recycling Chain – In essence…. There are only six integrated smelters in the world that have been modified to process the complex materials contained in semiconductor scrap. Environmental Stewardship:  The current Best Available Technology for final processing of Semiconductor complex scrap to elements is an integrated smelter.  Integrated Smelter technology represents massive capital investments and these smelters exist only in Canada, Germany, Belgium, Sweden, Japan and Australia. The Recycling Chain and your Company Utilize Best Available Environmental Technology Understanding Semiconductor Scrap Materials The reasons for and benefits of the lot# system are: Descriptions of Semiconductor Scrap Semiconductor Scrap Management Program Objectives – Continued The reclaim chain of custody: Security can help prevent E-Waste theft and counterfeiting An example of illegal activity and subsequent prosecution. Semiconductor Scrap Management Program Objectives – Continued Your Reclaim Program You’re Decision The Optimal Reclaim Provider will: Valuation of Scrap Materials and Revenue Return One of the most difficult concepts to explain is the process of determining the value of your materials. YOU must understand what it is that you have and what expected returns you should be expecting considering transportation, proper environmental processing, IP protection and cost of management. The dilemma: How do you look at 10,000 Kg of scrap material and place a value on it? The Answer: Robust Statistical Sampling Single Provider Consolidation Benefits Single Largest Benefit of using EcoTech Recycling Business Considerations for Selecting Reclaim Vendors

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SESHA 2011 Symposium Abstract

Improving the End-of-Life for Electronic Materials via Sustainable Recycling 

Korzenski, Michael; Jiang, Ping
(ATMI, Danbury, CT)

The production of electronic equipment such as computers, cell phones, TVs, etc. is one of the fastest growing global manufacturing activities. Unfortunately this results in substantial quantities of waste electric and electronic equipment (WEEE). In 2008, the US generated 3.16 million tons of e‐waste, and of this amount, only 430,000 tons or 13.6 % was recycled1. The remaining WEEE was sent to landfills, incinerators, or shipped overseas to “backyard” smelters. Globally, some 20 to 50 million metric tonnes of e‐waste are generated every year2. Rapid economic growth, coupled with urbanization and growing demand for consumer goods, has increased both the consumption of electronic equipment and the production of WEEE. This is a major source of hazardous wastes that poses a risk to the environment, human health and to sustainable economic growth. To address potential environmental problems stemming from improper management of WEEE, many countries and organizations have drafted national legislation to improve their reuse and recycling and to reduce the amount and types of materials disposed in landfills. Recycling of WEEE is important not only to reduce the amount of waste requiring treatment, but also to promote the recovery of valuable materials and to save natural resources needed to mine and extract new materials from the earth. Electronic waste is diverse and complex with respect to the materials and components used3, thus new technologies are needed for developing cost-effective and environmentally sound recycling systems. In this talk we will present novel processes/chemistries and enhanced process efficiencies based on green chemistry and green engineering methodologies for recycling waste electronic materials. We will demonstrate that one can recover metals and valuable components from end-of-life products using cost effective, sustainable, and scalable methods (e.g., systems that are closed loop, energy efficient, environmentally benign). This includes both chemical desoldering and precious metal reclaim with all metals recovered and resold. 1. “Municipal Solid Waste Generation, Recycling, and Disposal in the United States: Facts and Figures for 2008.” United States Environmental Protection Agency, Office of Solid Waste (EPA‐530‐F‐009‐021, November 2009. 2. Press Release, “Basel Conference Addresses Electronic Wastes Challenge.” November 27, 2006, United Nations Environment Programme (UNEP). 3. For example, one ton of used mobile phones (~6,000 handsets, a tiny fraction of today’s 1 billion annual production) contains approximately 3.5 kg of silver, 340 grams of gold, 140 grams of palladium, and 130 kg of copper with a combined value of over US $15,000 at today’s prices (http://www.sciencedaily.com/releases/2009/09/090915140919.htm).

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SESHA 2011 Symposium Abstract

Creating the Green Fab standard labeling for Taiwan Semiconductor Industries

LU, Joey ; Cheng, Ju-Hsiu; Shu, F.M.
(TSIA)

In last year’s, there are many industries invest a lot of money and ad-space toward making their products more attractive to consumers who were increasingly concerned with the environmental impacts of products in Taiwan. Because of the need of clean production standards, Taiwan government want to set a “Green Fab Labeling” for each industry in the future. Taiwan semiconductor industry association executes a demonstrated project of the Green Fab Labeling which cooperates with the Ministry of Economic Affairs cooperation in Taiwan. The standard labeling is not like the LEED system, it is focus on the clean production manufacturing. The Green Fab Labeling criteria items including Ecology (Biodiversity Green Plants Sustainable Drainage Systems), Energy (Energy Saving Process Energy Saving (Clean Room) Monitoring Energy Use Green Transport、Green Modes Renewable Energy Source), Waste(Building Waste Reduction and Others issues(Environmental Offset Measures and Education and Training).This article will introduce the TSIA’s member how to assist Taiwan government to create a demonstrate “Green Fab Labeling” for semiconductor and other industry. This paper will also show the contents of standard draft.

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SESHA 2011 Symposium Abstract

Research of reduction carbon dioxide emission by applying microalgae biotech in semiconductor factory

Ching-Lung, Cheng
(Powerchip Technology)

Industrial activities have improved human life, but also have increased greenhouse gases (GHG) emission into atmosphere, to cause the rising of the Earths average temperature and the other serious environmental problems. For solving these problems, there are many carbon reduction technologies are under development and application fast, such as physical treatment, chemical treatment and biological fixation. Today we plant a lot of trees to fix and transfer carbon dioxide(carbon sink) for the sake of carbon reduction. Therefore, carbon capture and storage have also been considered as an indispensable option to reduce carbon emission. Extensive research has been conducted to evaluate the feasibility of large-scale permanent carbon storage in oil fields and ocean beds. These carbon storage methods appear to be the potential solution for carbon reduction, but the highly cost, long-term stability, carbon reduction effect remains questionable. Microbial photosynthesis, particularly by microalgae, is now being reconsidered as a viable technology to reduce carbon. These processes are also attractive because the microbial extracts may possess substantial commercial values such as dietary supplements and fuels. In this study, we design an integrated CO2 biofixation system that consists of three parts, including CO2 scrubber system, and submerged membrane harvesting system. A laboratory-scale system was built to investigate the technical feasibility, and the pilot-scale system has been subsequently installed on semiconductor manufacture factory to reduce CO2 that emit from boiler process exhaust. The boiler use nature gas as fuel, and its exhaust contain CO2 about rather consistent at 16.1% and its temperature fluctuates between 50 and 60°C. We used wet scrubber to wash CO2 into water and supplied the carbon resource to grow microalgae in the close-loop photobioreactors, and microbial photosynthesis processes are designed to achieve faster growth rate, better carbon fixation efficiency, and greater growth density, then we generate and gain the concentrated microalgae in the membrane harvesting system. Microalgal CO2 Fixation appear to be a potential solution for carbon reduction in the semiconductor fab. In the future, we will plan to combine regenerating energy to develope a cost-effective energy-saving systems and try to test the large module. The test results will provide reliable data to reduce carbon emissions in the semiconductor fab.

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SESHA 2011 Symposium Abstract

Environmentally-Benign In-Line Cleaning Solutions for Advanced Semiconductor Manufacturing

Chen, Tianiu ; Hogan, Todd ; Korzenski, Michael 
(ATMI, Danbury, CT, Intermolecular, San Jose, CA)

Baseline cleanliness has been an area of concern for the IC production community, and as dimensions of the most advanced ICs continue to shrink it is becoming more critical. In previous geometries, cleans were focused primarily on the product wafer. Now, as shrinkage continues, in-line cleaning of the process tool sets are being enabled. ATMI partnered with a leading OEM to deliver the first such in-line cleaning approach. With the aid of combinatorial screening tools, we developed novel, low odor, and environmentally benign formulations that deliver a time- and cost-effective in-line cleaning method of the OEM tool set.

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SESHA 2011 Symposium Abstract

Losses in the Semiconductor Industry – Case Studies and Lessons Learned

Acorn , William 
(Acorn Consulting Services, LLC)

The author will discuss several large losses incurred by semiconductor and similar advanced manufacturing clients that resulted not only in business interruption, but significant out-of-pocket expenses. Case studies will address: 1. Fire in wafer fab – catastrophic losses, business interruption, lengthy litigation 2. Fire in flat panel display manufacturing facility – catastrophic losses, business interruption, lengthy litigation 3. Chemical leak in wafer fab – catastrophic losses, business interruption, lengthy litigation 4. Alleged unsafe environments in wafer fabs result in employee claims and protracted lawsuits The author will address the impact of these cases not only from business interruption, but distraction of the owners’ employees from more productive endeavors

Towards harmonization of measuring and reporting product sustainability

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SESHA 2011 Symposium Abstract

Leveraging existing SEMI guidelines to drive leading-edge supplier environmental, health, safety and sustainability programs

McIntyre, Andy; Firu, Diane
(EORM, San Jose, CA)

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Description: By utilizing existing SEMI environmental and safety standards, EHS professionals can work with their sustainability and corporate social responsibility counterparts to add scientific basis and depth to corporate supplier responsibility programs. Implications are that newer industries, such as Photovoltaic (PV) manufacturing, can leapfrog the amount of time it took the semiconductor industry to establish industry standards for manufacturing equipment and labor suppliers. Additionally, EHS professionals in all industries can bring significant value to their companies’ sustainability programs and drive cost and risk reduction in the business. Example approaches will focus on the PV industry but will be broadly applicable to any emerging process intensive market area. Speakers: Speakers will include EORM’s Andy McIntyre, CIH and Managing Principal and Rebecca Sternberg, Sustainability Practice Lead.

SESHA 2011 Symposium Abstract

Building Information Modeling: A Process to Mitigate Risk, Improve Project Delivery, and integrate Sustainability into Semiconductor Facilities

Chasey, Allan
(Arizona State University, Tempe, AZ)

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Building Information Modeling (BIM) is an approach gaining traction in the architect, engineer and construction (AEC) industry. BIM combines the ability to construct a virtual model with all aspects of a facility, from design (space planning) to construction (cost and scheduling) to operations and maintenance (planning and asset management). BIM is also a process as well as a project. Even though the technology for implementation of BIM will change, and probably change rapidly, the process and underlying concepts will likely change very little. BIM directly relates to a project team’s ability for Visualization, Understanding, Communication, and Collaboration: Visualization to “see” the project, Understanding to know the project elements, Communications to ensure the understanding, and Collaboration to receive all the necessary input at the proper time. BIM requires openness amongst the team players for sharing information supporting the goals of the project. Building Information Modeling (BIM) has become a valuable tool in many sectors of the capital facilities industry. The fundamental characteristic of BIM is its development through an information feedback loop. The development of the visual model and the relevant project information is iterative in nature as different project team members develop the project. During the course of a project, the information gradually increases in scope, depth, and relationship to the project. This presentation will focus on the benefits of BIM and how this process can be used to mitigate risk and improve project delivery for both new facilities and upgrades, introduce sustainability efforts and determine impacts during both construction and operations. The reduction of risk and value-added sustainability comes through improved understanding, coordination, and material use in the management of the project as well as reduced conflicts, waste, and cost. We will introduce the concept of Intelligent Tool Models and Intelligent Fab Models.

SESHA 2011 Symposium Abstract

Safety of personnel working near track for “Overhead transportion vehicle”

Ibuka, Shigehito
(Tokyo Electron Limited, Fuchu, Tokyo Japan)

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Recenlty unmanned transportion vehicle systams running overhead (OHV:overhead transportion vehicle) are often used in almost 300mm wafer IC fabrication plants. On the other hand, height of equipment becomes higer and higher. Personnel has to work upperside of the equipment such as a furnace, wet station or coater-developer. OHV is running near the personnel. How to protect the personnel not to crush into the OHV is very high concern. Recent updated SEMI S17 is one approach for vehicle safety design. At the last bSEMICON Japan, a workshop to share concerns of facts, and to discuss ideas to improve the situation among industry people. SEMI Japan and SEAJ is collaborating to plan next workshop. I would like to introduce Japanese activities for the subjects and know global audience suggestions for our approach hereafter.

SESHA 2011 Symposium Abstract

Integrated e-ESH System

Hsu, Fang-Ming 
(Hsinchu, Taiwan)

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Integrated e-ESH System Fang-Ming Hsu Deputy Director, Risk Management and Corporate ESH Division Taiwan Semiconductor Manufacturing Company, Ltd. Chair, ESH Committee, SIA in Chinese Taipei ESH management in semiconductor industry is essential but very complex. In order to make it effective, experts may have to spend quite long time, maybe for years, for trial and error. And, after semiconductor companies with its daily management have both become mature, people often find they have lots of, or too many, ESH sub-systems in place, and some of those sub-systems are even overlapping with others. Therefore, it’s time for the companies to enhance their systems’ efficiency. A way of enhancing ESH management efficiency is computerizing and integrating all ESH management systems. Finally, an integrated e-ESH system can benefit the company not only with enhanced management effectiveness and efficiency, but also reduced cost and mitigated risks. TSMC has adopted PDCA cycles into this system and will share its experiences at this session.

SESHA 2011 Symposium Abstract

Safety Analytics: The Future of Workforce Safety and Health

Hohn, Todd ; Duden, Dave 
(Vendor)

What Is Safety Analytics? Safety analytics is an emerging science that is helping to drive improvements not only in workforce safety and health programs, but also in overall business performance. Deloitte Consulting, a leading practitioner in this field, defines safety analytics as “the science of studying the underlying causes of and contributing factors to workplace accidents.” On the surface, that may sound similar to what top workforce safety and health professionals have done all along. But what’s new — facilitated by software tools and systems like PureSafety’s — is the amount and range of data that can be analyzed. For example, part of what distinguishes safety analytics from past practices is the use of external data (demographics, lifestyle indicators, industry financial data, etc.), as well as traditional historical and observed data. Among other benefits, this approach helps to ensure that human variables are appropriately weighted in identifying risk and taking appropriate preventive actions. Combined with the growing use of leading indicators, leveraging safety analytics gives you a more complete, and more current, picture of everything from specific work processes and locations up to the health of your safety culture in general. This, in turn, leads to a more targeted, proactive allocation of available resources and opens the path to continuous improvement in critical areas, including: • Workplace accidents and injuries • Compliance • Productivity • ROI on safety expenditures • Employee satisfaction, morale, loyalty and retention • Absenteeism • Product/material damage • Managerial efficiency and effectiveness • Corporate reputation

SESHA 2011 Symposium Abstract

Surface Contamination of Dummy Wafer and its Health Effect in Semiconductor Manufacturing Industry

Choi, Kwangmin
(Samsung Electronics Co. LTD)

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Dummy wafer has been effectively used to monitoring of equipment and process in semiconductor manufacturing industry. However, it has been predicted human health impacts by hazardous by-products which could be generated on the wafer surface by chemical reaction of various precursors such as toxic gases and chemicals. Although there has been much attention on the issue, it has not been studied yet. In this study, therefore, we have explored the surface contamination of the dummy wafers which have been used in semiconductor processes by quantitative and qualitative analysis methods. From the results of the organic contamination analysis of the dummy wafers at room temperature, it could not be confirmed some specific compounds, except that a few components such as toluene and siloxane were detected less than 1 ppbv. Further, we also found that ion (NH4+, F-, NO2- etc.) and metal contaminations (Al, Si etc.) of the dummy wafer surface are similar to those of blank(i.e., bare wafer), whereas it was detected ca. 70~90 ppb of Si on the surface of wafers used Etch and Diff decap process. From the TDS(50~900℃) results, meanwhile, the dummy wafer used only Etch process out-gassed CxFy, CxOy and CxHy contaminants which are induced by process gases such as CF4, CHF3, C3F8 etc. However it could be mentioned that the operator’s exposure by the CxFy, CxOy and CxHy has little possibility because the dummy wafer becomes de-gassed and room temperature after finished process and/or monitoring. The present results showed that the surface of dummy wafer had not contained by-products which are hazardous to human health. The dummy wafer used only Etch process out-gassed CxFy, CxOy and CxHy contaminants which are induced by process gases such as CF4, CHF3, C3F8 etc. However it could be mentioned that the operator’s exposure by the CxFy, CxOy and CxHy has little possibility because the dummy wafer becomes de-gassed and room temperature after finished process and/or monitoring.

SESHA 2011 Symposium Abstract

Prevention Maintenance Protection and Hazards Exposure Control of Thermal Type Local Scrubber MAT

Tsou, Hsiang-ming
(United Microelectronic Corp.(UMC), Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.)

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No matter how much effort and investment has been taken by a semiconductor FAB to reduce the nuisance odor, the problems always exist. The reasons we found are there is no applicable investigation equipment and proper methodology, furthermore, the unusual odor will disappear rapidly before an emergency response staff handles it. Therefore, it is better to take prevention of odor in advance than to deal with it upon it occurs. Prevention maintenance(PM) is one of the main causes of odor in FAB. This paper presents a method to identify the main reason for causing odor during thermal type local scrubber(L/S) PM and reduce its influence. A plan was proposed for understanding the environment air quality and controlling hazards exposure risk over PM task of MAT thermal type L/S by using Job Safety Observation(JSO) and measuring gases concentration escaped. The result we got were there were hazardous gases, hydrogen fluoride(HF) being produced and the peak concentration was high enough to reach the level of Threshold Level Value-Time Weight Average(TLV-TWA) during the survey. Therefore an improvement equipment, Gas Separating Mask and a standard safety PM procedures for L/S were developed. It had been proved that by using the Mask, we could protect the health of operators and reduce the exposure risk for over 79.3%(as HF gas) effectively.

SESHA 2011 Symposium Abstract

Mitigation of Hazards Associated with Disilane in Semiconductor Manufacturing 

Westmoreland, Don
(Micron Technology, Boise, ID)

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Disilane use in semiconductor manufacturing is not uncommon although it represents only a small fraction of manufacturing process materials that contain silane. Manufacturing requirements which specify lower overall processing temperature make disilane an attractive alternative and it is finding a greater presence in the industry. From an application and safety perspective, it is easy to think of disilane as similar in most respects to silane and therefore could require similar handling procedures. We have experienced that the differences between disilane and silane are significant. Disilane usage requires unique consideration in system design and safety. Micron will share our experiences with disilane. We will also review the safe handling methods and system designs that we have developed to mitigate the potential hazards associated with disilane usage.

SESHA 2011 Symposium Abstract

Electronic Industry Code of Conduct 

Viera, Steve
(Intel, Chandler, AZ )

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The Electronic Industry Code of Conduct was established in 2004 to promote a common code of conduct for the electronics, and Information and Communications Technology (ICT) industry. EICC members participate on Work Groups to develop the association’s programs and tools. EICC members are committed to collaboration, and a common approach to corporate social responsibility (CSR) practices as they relate to the global ICT supply chain. EICC is also committed to collaboration with stakeholders to improve environmental and work conditions in the(ICT) industry. EICC hosts stakeholder events and solicits input from stakeholders for continuous improvement of the Code of Conduct. The Code of Conduct provides guidance in five critical areas of CSR performance: • Labor • Health and Safety • Environment • Management System • Ethics

SESHA 2011 Symposium Abstract

Practical Application of SEMI S23

Evanston, Chris 
(Salus Engineering International, 3004 Scott Blvd, Santa Clara CA, 95054)

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This presentation will cover the practical use of SEMI S23, “The guide for conservation of energy, utilities, and materials used by semiconductor manufacturing equipment.” It will start by covering state of the art measurement techniques for key utilities required to be measured by SEMI S23: three phase electrical energy measurements, intrusive and non-intrusive N2 and CDA measurements, exhaust measurements, non-intrusive cooling and DI water measurements. Next, the use of this raw data to calculate overall equipment energy consumption will be explained. Finally, the SEMI S23 requirement for developing an improvement road map will be discussed, along with the ultimate confirmation of reduction by a second set of measurements on equipment modified to reduce energy consumption. All of this information will be put in the context of where the semiconductor industry is at with regard to implementation of these requirements, and where it may be going in the future.

SESHA 2011 Symposium Abstract

Energy savings by air coil efficiency improvement

Deschenes, Stephen; Bernard, Ron; Galbreath, L Gregg
(Nalco Company, Naperville, IL)

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Energy savings by air coil efficiency improvement Stephen Deschenes, Ron Bernard, Gregg Galbreath, Brian Jenkins, Nalco Company The primary heat transfer surfaces between the air inside a fab (semiconductor fabrication facility) and the HVAC (heating, ventilation and air conditioning) system are the air cooling and heating coils. Consistent climate control is critical to a fab’s reliable manufacturing environment. Air cooling coils are also a large consumer of fab electrical & fossil energy; yet often times, these systems’ cleanliness receives a lower priority due to competing maintenance tasks, or, the tools available to clean the systems are not effective. Most major semiconductor companies have goals for continuous improvement in energy operations. In the example cited in this presentation, a large semiconductor manufacturer, seeing the potential savings opportunity, worked with Nalco to implement an HVAC Performance Improvement program. Working together, Nalco and the fab obtained baseline data, and then Nalco cleaned and disinfected the air handler coils and associated drain pans. After the work was completed, performance measurements were taken to validate the efficiency improvements in the HVAC systems. The average heat transfer efficiency improvement was 11.5%, and the fan energy saved was 194.8 amps enabling the fab to pay for all of the program costs via reduced energy costs in just over 13 months. Associated with improvements in heat transfer, chilled water & heating water flow requirements to the air coils were also reduced. The paper discusses a range of cleaning methods, and reviews in detail the approach used by Nalco at the fab. Fan energy data as well as details on thermal energy savings calculations are also presented. Future savings potential is discussed, as well.

SESHA 2011 Symposium Abstract

Save Energy and Reduction of Greenhouse Gas by Energy Recovery System

Park, Jong Bok; Lee, Moon Ha; Jeong, Yun Yeong
(Hynix Semiconductor Inc., Icheon, Korea)

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In 2010, Hynix Semiconductor introduced Energy Recovery System to save Energy and reduce Emission of Greenhouse gases. Usually industrial water temperature for Semiconductor Manufacturing is at least 21 degrees but law water temperature was only 4 degrees in winter. So we had to raise the law water temperature by steam boiler before using water. On the other hand, discharge water temperature was about 25 degrees all the time. So local residents had experienced inconvenience because of fog in winter. Energy Recovery System uses thermal energy of discharge water to heat up law water until 21 degrees by heat exchanger. By introducing Energy Saving System Hynix Semiconductor has saved 76,000 ton of steam in one year (equivalent 12% of total steam usage) and reduced 18,000 ton of CO2 emission. (equivalent 4300 pine trees absorb in one year.) Also fog was disappeared in winter season. This presentation includes quantitative/qualitative analysis of economic effects of saving energy and decrease in CO2 emission by introducing Energy Recovery System. Also important matters should be considered before introducing this system are specified. Many companies feel the need to reduce greenhouse gases but they hesitate aggressive Activities because of huge investment cost compared to small economic benefits. We think our Energy Recovery System could be a good case shows that efforts to reduce greenhouse gases make economic benefits and save earth.

SESHA 2011 Symposium Abstract

PCS PIRANHA plasma abatement system: Update of evaluation on 300mm Etch process

Kopatzki, Eckard; Guerin, Joe
(CS CLEAN SYSTEMS)

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Introduction by the EPA in mid 2010 of Reporting rules on greenhouse gases has led to a heightened level of interest in PFC reduction within the semiconductor and related industries. In view of the limited number of practical options available to the typical semiconductor manufacturing facility for the curtailment of CO2 equivalent emissions, PFC abatement offers a convenient route to more environmentally-friendly manufacturing as well as compliance with present and future EPA policies. The PCS PIRANHA plasma conversion system uses a 2kW or 3kW microwave plasma to decompose PFC gases into reactive fluorine/ fluoride species which are readily removed by a downstream scrubber. The unit is fitted inline within the vacuum foreline between the etch chamber exhaust and dry roughing pump. A 2.45 GHz microwave is generated by a magnetron and conducted into the exhaust gas stream. This setup ensures that the full microwave power is focussed on the PFC gases prior to dilution by the N2 ballast of the dry pump, allowing very high PFC destruction efficiencies to be achieved. This presentation will discuss the results of current testing carried out using a 3kW pre-pump microwave plasma device. The evaluation is being carried out in conjunction with a vendor of Etch tools using state-of-the art 300 mm recipes over a wide range of PFC gas flows and foreline pressure regimes.

SESHA 2011 Symposium Abstract

Guideline for GHG Emission Measurement and Management

Kagino, Minoru
(Toshiba, Tokyo Japan)

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JEITA thinks that we need grasp of the amount of emission of F-GHG in order to advance a battle against global warming, and the technique of the suitable and efficient amount grasp of F-GHG emission contributes to progress of the battle. The IPCC 2006 guideline requests that the performance is measured and checked under a use situation as the conditions which can use a default value at the abatement efficiency of F-GHG abatement equipment. JEITA had already exhibited the guideline for measurement. Since JEITA revised this extensively this time, I will introduce this. This guideline provides the efficient measuring method and the management method such as time and frequency of the efficient measurement to users of the equipment which use F-GHG. And it will assist users to grasp exactly the amount of emission of F-GHG which oneself has discharged, and to make plan for reduction based on these results, and to carry out.

SESHA 2011 Symposium Abstract

Global warming evaluation of Chamber cleaning gases by new indicators, CEWN and CETN

Sekiya, Akira; Okamoto, Sayuri
(National Institute of Advanced Industrial Science and Technology (AIST) , Tsukuba, Ibaraki, Japan)

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Dealing with the global warming is still big issue because the Earth temperature has been rising. Semiconductor and liquid crystal industries have been used long-lived fully fluorinated compounds that have high global warming effects. The long-term evaluation of global warming caused by the use of these gases has to be paid much more attentions. On the other hand, evaluation metric is quite important to get scientifically reliable results. In this paper, using LCCP (Life Cycle Climate Performance) data of our previous work, CVD chamber cleaning gases are evaluated by new global warming indicators, CEWN1) (Carbon Dioxide Equivalent Warming Number), CETN2)　(Carbon Dioxide Equivalent Temperature Change Number), and s-CETN2) (square-Carbon Dioxide Equivalent Temperature Change Number ). CEWN evaluates based on radiative forcing as GWP3). CETN and s-CETN are based on the global surface temperature rise by Shine’s equation4). CEWN and CETN compare GHGs by unifying the removal rate of each gas from the atmosphere, while s-CETN unifies the ratio to the total amount of the global warming of each gas. They provide fair index of global warming to each GHG. LCCP data is analyzed using GWP, CEWN, CETN, and s-CETN and compared. Results show that CEWN, CETN, and s-CETN are as easy-to-use as GWP. Further, the relation of CEWN, CETN, s-CETN values with the climate impact is clearer than that of GWP values. According to those new indicators, the order of global warming is C2F6 > C3F8 > NF3>> COF2. In the case where 16% 5) of NF3 production releases into atmosphere, the global warming of NF3 is comparable with C3F8. The paper includes: a) the explanation about CEWN, CETN, and s-CETN. b) the LCCP results of global warming analyses by various indicators, such as CEWN, CETN, s-CETN, GWP, and so on. Literature: 1) A. Sekiya, and S. Okamoto, J. Fluorine Chem., 131 (2010) 364-368. 2) A. Sekiya, and S. Okamoto, 20th Winter Fluorine Conference, St.　Pete Beach, FL, Jan. 9-15, 2011. 3) IPCC Climate Change 2007. 4) Shine, et al., Clim. Change, 68, (2005), 281-302. 5) R. F. Weiss, et al., Geophys. Res. Lett., 35 (2008) L20821.

Closing Ceremony SESHA/IHTESH

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SESHA 2011 Symposium — PDC5

Fundamentals and EHS Challenges of PV Manufacturing

Andrew McIntyre

Welcomes, Introduction and Course Objectives

• • Andrew McIntyre, CIH – Managing Principal – Environmental & Occupational Risk Management, Inc. (EORM)
    • 8:00 – 8:10am
• Key Note – Global Regulatory Drivers and Challenges
  • Lisa Krueger – Vice President of Sustainability – First Solar
    • 8:10 – 9:00am
• Solar Energy Industry Association (SEIA) EHS Initiatives
  • Christine Covington – Manager of Government Affairs; Environment, Health, & Safety – Solar Energy Industries Association (SEIA)
    • 9:00 – 9:40am
• Industrial Hygiene, Safety, Fire Protection and Environmental Risk Considerations and Controls(Speakers from the following Crystalline and Thin Film Process Manufacturers)
  • Crystalline PV – Jim Larson – EHS Manager, SunPower
    • 10:00 – 11:00am
  • Cadmium Telluride (CdTe) PV – Ken Smigielski – EHS Engineering Group, First Solar
    • 11:00 – Noon
  • High Efficiency Multijunction Concentrator Cell PV – Holly Baez, EHS Manager, Spectrolab, a Boeing Company
    • 12:30 – 1:30pm
• Corporate Social Responsibility – Challenges and Opportunities for the PV Industry
  • Todd Brady – Global Environmental Manager – Intel Corporation
    • 1:30 – 2:15pm

Supply Chain Management

• • Leann Speta – Supply Chain Sustainability Manager – SunPower Corporation
    • 2:15 – 3:00pm
• Installer EHS Considerations – Residential, Industrial, and Solar Farm/Utility Level
  • Paul Shatkyvich, SHE Manager, N.A., SunEdison
    • 3:15 – 4:00pm

Recycling Processes & End-of-Life Considerations

• • Jennifer Woolwich, MA, CPHQ, CSSBB – CEO – PV Recycling, LLC
    • 4:00 – 4:45pmv

SESHA 2011 Symposium — PDC6

Exhaust Management, Point-of-use Abatement Devices, Electronics Industry Greenhouse Gas Reporting Rule, and Process Emissions and POU Abatement Device DRE/Emissions Testing Methodologies

Mike Sherer

Semiconductor process and fab exhaust management procedures and strategies will be presented. Many of these also apply to LCD, solar and related industries. Discussion of fluorine, particulate, ammonia and ozone will be highlighted. Point-of-use (POU) abatement technologies overview will be provided. Important items to assist personnel in reducing maintenance and increasing uptime will detailed. The EPA Greenhouse Reporting Rule for electronics industry will be presented and any lessons learned provided. The EPA Testing Protocol for POU abatement device Destruction and Removal Efficiency (DRE) and the 2009 ISMI Testing Guideline will be presented. This overview will allow the attendee to understand how testing is conducted and how to work with testing suppliers.