How To Install Tools And Manage The Change Process – An Applied Materials Case Study
Creighton, Susan; Zude, Aaron; Gopalakrishna, Varun
(Applied Materials, Inc., Santa Clara, CA; Facilities and Safety Solutions, Newark, CA; Environmental & Occupational Risk Management, Sunnyvale, CA)
Installation of semiconductor processing tools in an R&D cleanroom or wafer fab environment requires the identification, interpretation and application of: equipment safety design principles; physical installation design criteria; project design review processes; and final installation inspection, commissioning and sign-off protocols. To be successful in achieving consistent, timely and cost effective tool installations that satisfy fire, building, mechanical and plumbing code requirements as well as EH&S regulatory requirements and internal company standards/best practices, a well defined and documented tool installation process is required. However, the successful installation of the tool is only the beginning of the tool life cycle. Once operational, a management of change process is needed to ensure that planned physical or procedural changes which may impact the EH&S management of the tool are identified, evaluated and approved prior to enacting the change. This 1 day PDC will provide participants with comprehensive hands-on experience in the semiconductor tool installation process through application of the tool installation processes and procedures used at Applied Materials Santa Clara and Sunnyvale facilities. Using a workshop approach, participants will learn first hand what it takes to successfully install and commission a semiconductor tool in an R&D cleanroom or wafer fab environment.