Implementing ISO 13849-1; An Equipment Manufacture’s Perspective
(Tokyo Electron U.S. Holdings, Inc.; Chandler, AZ)
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Performance Level’s: Why Now? Current semiconductor equipment design standards already reference ISO 13849-1, but not many engineering teams have taken the leap to implement yet. Currently both EN 954-1 (1996) and ISO 13849-1 (2006) can be used by the equipment builders, users and integrators to help prove their presumption of conformity to the Machinery Directive (2006/42/EC). It’s important for us remember that after Dec 31st, 2011, only EN ISO 13849-1(2008) may be used for this purpose. There are different arguments being made on when we should implement. The proponents of the standard say that protective measures have evolved to keep pace with the increasing automation complexity, and that customer’s want to future proof their machines. Additionally, it is specifically mentioned multiple places within two semiconductor specific design guides (EN 60204-33, Section 9 and SEMI S2 Sections 11, 12, and RI 13. The “naysayers” say that its overkill and not needed, as our equipment leads the world in safe design/manufacturing. Additionally, both the Machinery Directive and SEMI S2 guideline allows for a risk based approach which permits certification without following this specific harmonized standard (e.g conforms to performance goal versus conforms to stated criteria). It has also been viewed as being overly-complicated (fear factor to undertake). TEL U.S’s. Product EHS embarked on task of applying ISO 13849-1 to one of our new equipment’s design within a US-based TEL Engineering Group, and its will be evaluated as a learning tool for other TEL Engineering groups in Japan. Roadblocks and lessons learned will be shared.