Novel Wafer Cleaning Technologies Survey
Pawsat, Sally (International SEMATECH, Austin, TX)
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Effort continues in the semiconductor industry to identify novel wafer cleaning technologies that offer lower water and chemical consumption and move towards more benign chemistries for both front end and back end process applications. Six emerging novel cleaning methods are reviewed in this paper: DI/Ozone (DIO3), DI/Hydrogen, Supercritical CO2 (SCCO2), Densified Fluid Cleaning (DFC), Steam Vapor, and Sulfur Trioxide (SO3). For each technology, the paper will discuss cleaning mechanism, process chemicals and conditions, environmental, safety and health issues and technology status. The process application, contaminants removed and chemistries replaced will be identified.