SESHA 2001 Symposium – PDC Abstract View

PDC 1 – RF Radiation Safety: Understanding the Risks and Practical Solutions

Organized by: Richard Strickland; Narda and Andy Giles; Global Semiconductor Services

Target Audience: Intermediate (2-10 Years Experience)

This half-day course covers the specific risks to personnel in the semiconductor industry associated with RF radiation. This is an update of the PDC`s offered in 1995 and 1996. It addresses the needs of EHS professionals in the semiconductor industry regardless of level of experience that must deal with RF radiation sources. This PDC identifies the specific risks to personnel and recommends practical, effective means to control RF emissions and protect personnel. The course describes the biological effects, regulatory compliance, control measures, and measurement techniques needed to implement and maintain an effective RF Safety Program.

SESHA 2001 Symposium – PDC Abstract View

PDC 2 – The Basics of a Successful Incident Recovery

Organized by: Robert Barnes; Robert B. Barnes Associates, Inc.

Target Audience: Intermediate (2-10 Years Experience)

Every fab should expect to have at least one business interruption incident each year. That is a fact. Not every fab is ready to rapidly recover from such an incident. That, unfortunately, is also a fact. Each incident is also entirely different and too much generalization is not appropriate; however, there are some key similarities. Most importantly, the manner in which the initial response is handled by facility personnel, vendors, and recovery specialists directly affects the outcome. Simply put — the most effective way to minimize the impact of even the briefest business interruption event is to ensure that the initial response is handled efficiently and professionally. This half-day session will provide participants with an opportunity to learn how others have dealt with the most common fab incidents (both successfully and unsuccessfully) and will lead to the development of personal set of key action guidelines that each participant can immediately put into practice when he or she returns home.

SESHA 2001 Symposium – PDC Abstract View

PDC 3 – 14001: Everyone Is Doing It, Can You?

Organized by: Alicia Oakes; Environmental and Occupational Risk Management

Target Audience: Beginner (0-2 Years Experience)

ISO 14001 is becoming wide spread as more vendors and clients are requiring companies they work with to attain ISO 14001 certification. You know your company wants ISO 14001 certification, now it is time to put an environmental management system (EMS) that is compliant with the ANSI/ISO 14001-1996 standard in place.
This course is designed to provide students with the tools to develop and implement an effective EMS with the goal of attaining certification to the ANSI/ISO 14001-1996 standard.

During this PDC the key elements of the ISO 14001 standard will be presented through a series of exercises and discussions. The exercises and discussions will include practical methods of performing a gap assessment and will address key topics, such as environmental policies, planning an EMS, environmental aspects and impacts, objectives and targets, implementation and operation of an EMS, monitoring and measuring, nonconformance, corrective and preventative action, EMS audits, management review and documentation requirements. The format will be interactive and utilize industry examples to ensure students grasp both the intent and benefits of ISO 14001 requirements.

The information contained is this PDC can be used by an EHS professional to assist in attainment of a company’s ISO 14001 certification, if used properly. This PDC is intended to be introductory for the EHS Professional new to the semiconductor industry, but also intended for the EHS Professional who has not yet ventured into the ISO arena.

SESHA 2001 Symposium – PDC Abstract View

PDC 4 – The OSHA LOTO Standard Is Over 10 Years Old – Where Is Your Hazardous Energy Control Program Today? – A Benchmarking Class

Organized by: Robert Moats; EORM, Sunnyvale, CA and David Simpson; Intel, Folsom, CA

Target Audience: Intermediate (2-10 Years Experience)

This half day course will provide an intensive discussion of the control of hazardous energy covering the broad spectrum of requirements in the applicable OSHA regulations. The information will presented will draw from the presenters’ extensive experience in establishing and developing hazardous energy control programs from both the perspective of a consultant and a senior EHS manager in a factory environment. A brief overview of the pertinent regulations will precede in-depth presentations of the presenters’ techniques in the basic areas of equipment hazards analyses, preparation of written procedures, inspection of those written procedures. Also addressed are other relevant and related areas of this topic to include electrical safety, confined space entry, machine guarding, contractors, and the differences in state OSHA plans versus federal OSHA requirements. Participants will be given material, which includes analysis of the relevant code sections, many additional and valuable references, and sample working forms. The focus of this course is for experienced EHS professionals who have had difficulty establishing or sustaining an effective energy control program.

SESHA 2001 Symposium – PDC Abstract View

PDC 5 – Hazardous Gas Monitoring

Organized by: Logan White; Logan White Engineering

Target Audience: Beginner (0-2 Years Experience)

Monitoring hazardous gases is highly complex, yet critical to semiconductor manufacturing. This course will cover several codes relevant to the industry including the 2000 editions of the International Fire Code and Uniform Fire Code. Determining applicable codes and then understanding, interpreting and applying them is the initial step in developing a gas monitoring strategy. This course provides a good basis to successfully comply with code requirements.

Standards for integration of gas sensors into a monitoring, alarm and control system are reviewed. Requirements and benefits of redundancy are explained and evaluated.
Other topics to be discussed include: Occupancy Classifications, Gas Sensor Types & Selection Criteria, Typical Gas Monitoring System Architectures, Typical Programmed Responses, System Testing Requirements, Emergency Control Stations and System Certification.

SESHA 2001 Symposium – PDC Abstract View

PDC 6 – Design For Product Safety — Understanding SEMI S2/S8/S14

Organized by: James Wright and Andy Giles; Global Semiconductor Services

Target Audience: Intermediate (2-10 Years Experience)

This half day course will present the practical concepts of implementing SEMI S2/S8 Guidelines into the design and manufacture of semiconductor equipment. This course will examine the similarities and differences between S2-93A and S2-0200, and discuss the requirements to meet SEMI S8 Ergonomic Guidelines and SEMI S14 Fire Risk Assessment Guidelines. This course will also discuss how SEMI S2/S8/S14 will assist to meet the equipment safety requirements for Europe (CE Mark), Japan, and Korea (S-Mark). This course is intended to be generic enough for the equipment supplier product safety professional or design engineer, but it is also intended for the end user EHS Professional who desires to improve his/her understanding of the SEMI S2/S8/S14 requirements.

SESHA 2001 Symposium – PDC Abstract View

PDC 7 – Air Compliance Strategies for Semiconductor Facilities

Organized by: Jeanne Yturri; Zephyr Environmental

Target Audience: Intermediate (2-10 Years Experience)

The half day course will cover air topics of widespread interest to environmental managers at semiconductor manufacturing facilities. First, emissions control technologies and their performance characteristics will be discussed with a particular focus on the status of the proposed Semiconductor Maximum Achievable Control Technology standard and its implications on the control of emissions. The course will also describe strategies for securing permits that provide flexibility to respond quickly to changes in the market.

SESHA 2001 Symposium – PDC Abstract View

PDC 8 – Emergency Scene Management in Semiconductor Manufacturing

Organized by: Joe Caller; Philips Semiconductor

Target Audience: Intermediate (2-10 Years Experience)

Use of an Incident Command System (ICS) to manage hazardous materials emergencies is required by both OSHA and the NFPA. Most training classes on the subject of emergency management tend to emphasize the generic features–that the same basic model is used by fire, medical, disaster, and other emergency service providers. This course focuses instead on the unique setting of semiconductor manufacturing, and the type of ICS deployment used to manage emergency operations in that setting.

This half day PDC is based on a course developed specifically for leaders of a semiconductor Emergency Response Team, with the primary goal of making incident command more directly applicable to scenes they would typically respond to. This shortened version retains the hands-on exercises and scenarios that facilitate student learning. More importantly, it presents an instructional technology that enables emergency response coordinators to provide scene management training in their own situations.

SESHA 2001 Symposium – PDC Abstract View

PDC 9 – Toxicology and Biometrology of Arsenic Compounds Used in III V Epitaxial Growth Environment.

Organized by: Nicole Proust; THOMSON-CSF LCR ORSAY France

Target Audience: Intermediate (2-10 Years Experience)

It is very important to take speciation into account when toxicology and biometrology are evaluated. There are two kinds of arsenic chemicals: mineral and metalorganic molecules. The most important species and their physicochemical properties will be briefly presented. A special attention will be paid to solubility (insoluble, water or lipid soluble). Metabolism, detoxification and intoxication will be simply presented for a lot of arsenic species of both families (AsH3, TBA, DMAAs, arsenobetaine, GaAs…). Associated biometrology will be discussed, human experiences on volonteers conducted by toxicologists will be presented. The objectives being to understand the kinetics of metabolite excretion (dependent on the As starting molecule) and to be able to choose the right time for urine sampling. This is particularly important in the case of low exposure. Interferences caused by the diet (fish, water…) make the interpretation of the urine analysis difficult. The detail of the variuos metabolites excreted after consumption of such food will be reported. The results of biometrology obtained in our research center will be presented and compared to a recent work done on a non exposed population. And finally a review of the major health problems in the world (China, India…) related to mineral arsenic exposure will be done.

(This is a part of “Toxicology and safety in microelectronics”, a course awarded in Europe in 1992. First price in the category “Experts in Health and Safety at Work”).

SESHA 2001 Symposium – PDC Abstract View

PDC 10 – The Practical Use of SEMI S2/S8 Engineering Reports for the EHS Professional

Organized by: Andrew Giles, James Wright; GS3 and Mollie Foster; Novellus

Target Audience: Intermediate (2-10 years experience)

This half day course will present the practical use of the SEMI S2/S8 Engineering Reports for the site EHS Professional as an integral part of his or her site safety program. The SEMI S2/S8 Guidelines, has been in effect since 1993 and recently revised as a voluntary guideline within the semiconductor industry to establish a minimum and uniform set of guidelines to ensure the environmental, health, and safety performance of the manufacturing equipment. The primary emphasis in the Guidelines is placed on the equipment suppliers to design and manufacture their equipment to the guideline’s requirements and to have a third-party evaluation to verify compliance. However, the S2/S8 evaluation Engineering Report can also be a valuable tool for the Site EH&S Professional if it is used effectively. However, to be used effectively by the site EHS Professional, the information contained in the report must be understood. This course will examine the typical contents of a thorough SEMI S2/S8 Engineering Report and explain how it can be used by the Site EHS Professional to assist in compliance to national (e.g., OSHA, EPA, etc.) or local (e.g., Fire or Bldg. Codes) regulations, or company EHS policies. This course is intended to be generic enough for the EHS Professional new to the industry to understand, but it is also intended for the experienced EHS Professional who is not currently using the SEMI S2/S8 Engineering Report as a part of his/her safety program.

SESHA 2001 Symposium – PDC Abstract View

PDC 11 – Building Codes and Standards from the Perspective of the ES&H Professional – Liability Implications of the Standard of Care

Organized by: William R. Acorn; Acorn Consulting Services

Target Audience: Basic (0-2 years experience)

The codes and standards that govern the design, construction and operation of semiconductor manufacturing facilities are complex and subject to local interpretation. Bill Acorn will discuss the standard of care that should be considered by all ES&H professionals, whether the project is located in the US or abroad.
This PDC will provide an overview of the current code and standards applicable to high technology/hazardous facilities, with particular emphasis on those used in the semiconductor industry. Bill will discuss recent developments in codes and standards, including a brief discussion of the 2000 International Building and Fire Codes.
The “standard of care” as it relates to design, construction and operation is often considered to vary from location to location. In particular, when manufacturing and support facilities are built offshore, in jurisdictions that are more lenient than the U.S., the applicable standard of care may be unclear. What should U.S. companies do in terms of compliance with codes and standards? When is it not good enough to follow the local standard of care? What are the liabilities of a company and its employees in this kind of situation? While Bill cannot offer legal opinions, he will discuss matters that should be of concern to ES&H professionals responsible for ensuring suitable operating and working environments.

Bill will discuss a major fab fire as a frame of reference to this discussion. Utilizing his direct experience as an expert witness in a case involving a U.S. insurance company and an Asian facility, the concerns of building safe facilities abroad will be addressed.

SESHA 2001 Symposium – PDC Abstract View

PDC 12 – Advanced Topics in the Management of a Hazardous Energy Control Program

Organized by: Robert Moats; EORM, Sunnyvale, CA and David Simpson; Intel, Folsom, CA

Target Audience: Advanced (10 or more Years Experience)

The federal OSHA lockout/tagout standard has been in place for over ten years, and by now employers should have a well-established, comprehensive, and mature program in place. However, from the presenters’ experience many organizations have programs with large flaws or deficiencies due to short-cut solutions, paper-only programs, safety folklore, erroneous code interpretations, or have been daunted by the amount of professional energy needed to develop and sustain a viable program. The sheer economic necessity of having a comprehensive and efficient program is very important as federal OSHA has a track record of using lockout/tagout violations as a means to set an example of how serious they are about control hazardous energy. Lockout/tagout violations continue to appear in the top-ten list of cases resulting in multi-million dollar fines levied by OSHA each year. This intensive course will cover the presenter’s extensive experience with the development and management of hazardous energy control programs. Covered will be techniques of equipment hazards analyses, ‘selling’ the program, sustaining the program, difficulties with various groups you may encounter, specialized areas such as the difficulties with the SEMI S2 review process, folklore, traps and pitfalls, problems with discipline and discipline requirements in the program, relationship to other OSHA standards, problems with state OSHA standards, problems in large corporations with plants in multiple states, and difficulties in relationships with corporate-level EHS groups and plant level program implementation problems.

SESHA 2001 Symposium – PDC Abstract View

PDC 13 – The Science of Exhaust Management

Organized by: Joe Van Gompel and Vic Chidgopkar; BOC Edwards, Austin, TX and Wilmington, MA

Target Audience: Basic (0-2 years experience)

The Science of Exhaust Management goes over semiconductor exhaust abatement technology from a chemistry point of view. While tempting to think otherwise, there is no one-size-fits-all technology for point of use abatement. The course will have 4 specific segments: 1) The chemistry of exhaust management; 2) POU abatement technologies; 3) Case studies in exhaust management; 4) Methods of exhaust gas testing. There will also be a Special Topics session at the end of the course. The goal of the presentation is to educate the student about when a given abatement technology (say, wet scrubbing) is appropriate and when it isn’t.

SESHA 2001 Symposium – PDC Abstract View

PDC 14 – Silicon Processing – IH Hazards and Controls

Organized by: Michael Williams; Health Safety & Risk Management Services (HSRMS) and John Visty; EarthTech Microelectronics Group

Target Audience: Basic (0-2 years experience)

This course will provide an in-depth description of the key processing steps in the manufacturing of silicon-based integrated circuits for beginner/intermediate level attendees. Additionally, the instructors will provide their insights into the industrial hygiene and safety hazards of semiconductor processing. Attendees will be provided with the Chemical Safety Handbook, published by OEM Publications.
NOTE: This course will be similar in content to the course that was given at SSA 99 and 2000.

SESHA 2001 Symposium – PDC Abstract View

PDC 15 – Effective Use of Process Hazard Analysis to High Technology Equipment

Organized by: Kristin Malina; EORM

Target Audience: Intermediate (2-10 years experience)

The goal of this full day course is to enable participants to choose the most appropriate process hazard analysis (PHA) tool, facilitate the PHA process, and to interpret and communicate the results. The instructors will present detailed information regarding the use and applicability of qualitative and quantitative hazard analysis methods, ranging from checklist methods to Failure Modes Effects and Criticality Analyses (FMECA). However, instructors will focus the implementation portion of the course on those analysis methods which, in their experience, are the most efficient, and applicable to, equipment safety – Hazard and Operability Study (HazOp) and the formal “What if?” analysis.

PHA principles and benefits will be presented in the morning with a one-half day “hands-on” hazard analysis session on a mock valve box for a bulk chemical distribution system. After completing this course, participants will be able to:

• Identify when hazard analysis should be performed
• Choose the most appropriate hazard analysis method
• Implement the method effectively and efficiently

SESHA 2001 Symposium – Abstract View

Validated Diffusive Monitors: Meeting the Challenge of Personnel Monitoring

Kirollos, Kirollos (K&M Environmental, Inc., Virginia Beach, VA)
Mihaylov, Gueorgui (K&M Environmental, Inc., Virginia Beach, VA)
Chapman, Kimberly (K&M Environmental, Inc., Virginia Beach, VA)

Personnel monitors are devices designed to determine the exposure of airborne toxic substances within the breathing zone or other appropriate exposed body areas of workers. There is no doubt that handheld and area monitors have great need and applications in the workplace. However, the simplicity, light weight and low cost of personnel diffusive monitors make them highly advantageous over active samplers and area monitors in determining personnel exposures to toxic gases and vapors in the workplace. Three types of personnel monitors are described. Two types are colorimetric direct-read devices for monitoring hydrides, hydrogen chloride, hydrogen fluoride, acetone and 19 other contaminants. A new coating technology is used to fabricate the sensor. The color forming ingredients are encapsulated in a thin uniform layer on an inert surface to insure stability, color uniformity and accuracy. The intensity of the color developed in the sensor is directly proportional to the exposure dose. The third type is an organic vapor monitor for sampling over 120 volatile organics. The monitor operates by sorption / desorption process followed by standard analytical methods for the determination of exposure. The monitors are validated using a protocol based on the NIOSH Protocol for the Evaluation of Passive Monitors. The monitors were tested at concentrations from 1/10 to at least 10 times their corresponding permissible exposure limits. Relative humidities ranged from 10% to 90%, temperatures ranged from 10 to 35 degrees celsius and face velocities ranged from 5 to 160 cm/sec. At ambient conditions, the monitors showed overall accuracies better than +/-25% at the 95% confidence level.

SESHA 2001 Symposium – Abstract View

Arsine TLV-TWA Reduction Update

O’Brien, Margaret (Texas Instruments)

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The American Conference of Governmental Industrial Hygienists (ACGIH) proposed to lower the Threshold Limit Value (TLV)-Time Weighted Average (TWA) for arsine (AsH3) in the Notice of Intended Changes-1999 Threshold Limit Values for Chemical Substances and Physical Agents. The current TLV-TWA for arsine is 50 parts per billion (ppb) and the ACGIH’s proposal is to lower the arsine TLV-TWA to 2 ppb. Because of the potential significant impacts to the semiconductor industry, a subcommittee was formed under the Semiconductor Industry Association’s Occupational Health Committee to review the relevant arsine exposure data to ensure the science supported the 25-fold reduction. Exponent, a toxicological consulting company, was contracted to evaluate whether or not the proposed 2 ppb TLV-TWA for arsine was justifiable. The results of the Exponent review will be presented in addition to the status of the SIA Arsine Subcommittee and Compressed Gas Association activities.

SESHA 2001 Symposium – Abstract View

Teratogenicity of DUV Photoresist

Steele, Valerie (Intel)
Keller, Randal (Murray State University )
Gupta, Ramesh (Breathitt Research Center)
Canning, David (Murray State University)

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The purpose of this research was to study the teratogenic potential of DUV (Deep Ultraviolet) photoresist on avian embryonic tissue during very early developmental stages and correlate these in human embryos. Specifically, we examined neural tube closure, heart defects, cephalic formation, and axial defects. The embryo contained in the vitelline membrane was removed and cultured into a petri dish. The application of the DUV photoresist followed and the embryo incubated with four control embryos for 20 h at 38 degrees Celcius. The embryos were then analyzed by digital photomicroscopy. The effects of DUV photoresist were studied at three concentrations: 6 ppm, 3 ppm, and 1.5 ppm. At 6 ppm of DUV photoresist, embyrolethality was produced in 3 of 4 embryos tested. The single embryo that survived treatment showed failure of neural tube closure (spina bifida-like malformation). At 3 ppm, 7 embryos showed various malformations including abnormal head development, incomplete neural tube closure, and extensive axial defects. Importantly, the heart appeared to develop normally, demonstrating a potential neural tissue specificity. At 1.5 ppm, malformations in seven of ten embryos demonstrated restriction of somite formation along the body axis. This embryo model system can be used in testing to establish specific teratogenic effects in early stages of development and the results extrapolated to humans due to the fact that the genes controlling early embryonic tissue and cell differentiation/development in chicks and humans are identical. Reproductive toxicity testing in the MSDS for this chemical using inhalation methods did not produce any teratogenic effects. Our results suggest that DUV photoresist produces teratogenic effects when present in the bloodstream at levels as low as 1.5 ppm.

SESHA 2001 Symposium – Abstract View

Web-based Training for ESH

Brian Sherin

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SESHA 2001 Symposium – Abstract View

M&A EHS Due Diligence & Integration Process at Intel

Dorris, Martin T. (Intel)

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Understanding the potential merger or acquisition value drivers will help determine the level of EHS due diligence needed. Proper due diligence will provide an insight into the EHS risk management and challenges to expect during the integration phase of a new merger or acquisition. Determining how EHS fits into the overall strategy of the potential merger or acquisition will help make the integration phase goes smoothly and quickly. Just what does the due diligence phase consist of exactly and how is it accomplished in such a short period of time using an effective due diligence process. Understanding confidentiality issues during the due diligence process and when you should use an environmental consultant versus in-house resources.

SESHA 2001 Symposium – Abstract View

Due Diligence Process and Methodologies – How is it Done?

Lehmberg, Laurie (Texas Instruments)

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Due diligence in acquisitions is all about knowing what you might be buying, thus you must identify and quantify material or significant risks; properly value the liability; and frame the deal to shift or insure against risks by contract or other mechanisms. A comprehensive environmental, safety, and health (ESH) due diligence effort can be a significant undertaking but there are a lot of good reasons to consider the aggressive assessment of ESH issues at an early stage of the transaction. These actions help provide assurance that on-site or disposal/recycle facility contamination issues are better understood; that the potential for worker/neighborhood toxic torts have been evaluated; and that current compliance problems and future compliance costs have been identified and valued. The best argument for early assessment of ESH issues is that quite often, fundamental decisions regarding the desirability of the deal, the appropriate legal/financial structure, the scope of the acquisition, and valuation tend to “harden” with the signing of the Acquisition Agreement. In other words, even when one can wait to dig into the ESH details, information obtained during post-Agreement due diligence may arrive too late to effectively influence the deal. Therefore, it is important for ESH professionals to sensitize the acquisition team to the significant risks that ESH liabilities may pose to the deal assumptions.

SESHA 2001 Symposium – Abstract View

Integration of the Acquired Company – You Own it so What Now?

Roig, Randy (STC)

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While most of the focus in the due diligence process is on discovering the liabilities prior to a merger or acquisition, the success of the transaction depends on your ability to appropriately integrate the acquired company. In this talk, we will focus on four major items, 1) Dealing with the short-term compliance and liability issues which can include missing regulatory plans, permits or operating criteria immediately necessary for compliant operation. 2) Transfer of EHS documents and records such as medical and employee training including establishing a process to identify which records and priority for each. 3) Preserving the culture and assets that you acquired and 4) integrating the company into your EHS management system which involves knowing how quickly to impose Corporate reporting systems, and the amount of assisitance needed to meet the new requirements and goals. Size of the aquistion matters and will be addressed. The talk will include examples of integration processes, both successful and unsuccessful, and discuss how we can all learn from each other’s mistakes.

SESHA 2001 Symposium – Abstract View

An Overview of the Semiconductor Manufacturing Process

Benson, Roger (FM Global)

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This Overview presentation will cover the three basic process steps of 1) Layering-Oxidation, CVD and PVD 2) Patterning-Resist and Develop application, Exposure methods, Etching 3)Doping-Diffusion, Ion Implant. We will also look briefly at Wafer Manufacturing, Mask making and Back End Processes. The hazards presented by the processes and the chemicals used will briefly be discussed to set the stage for more detailed presentations on EH&S consideration in the Boot Camp Program.

SESHA 2001 Symposium – Abstract View

Certifications and Credentials for Environmental Professionals.

Williams, Jeffrey (Dept of Defense, Fort Meade MD)

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Practitioners in the environmental arena have a number of certifications and registrations that they can obtain. These certifications cover a wide variety of skills, ranging from training, management and engineering practice to hazardous materials and sanitation. There are even certifications for regulatory auditing as well as environmental management auditing. The use of credentials can be beneficial to semiconductor manufacturing operations from both an external and internal perspective. Looking outward from the company, certifications can be a useful measure of the qualifications found in suppliers of consulting and engineering support services. Looking within the company, they can be a measure of in-house capabilities and a metric for future advancement. They can, if not used properly, also provide little or no value added to the company. This presentation will examine the most common types of external certification available in the environmental arena. The strengths and weaknesses of each will be examined, and a comparison made between comparable levels of rival organizations. Additionally a summary of the requirements, sponsoring organizations and points of contact will be included.

SESHA 2001 Symposium – Abstract View

Effective Training Methods

Taylor, Kiley (Zephyr Environmental Corporation, Austin, Texas)

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Environmental, health and safety (EHS) programs are dependent on effective employee training. This paper explores the basics of teaching adults including methods, objectives, and learning styles. It focuses on EHS and emergency training and effective techniques to engage students and change the behavior of learners. Based on learning theory and research, participants will develop the knowledge needed to deliver effective, dynamic training that ensures the transfer of knowledge.

Roundtable Details

Thursday, April 14

Roundtable 1 – Room: Rhythm 3

Hot EHS Hazardous Gas Management Topics
Moderator: Logan White
The ESH Issues in Hazardous Gas Management Round Table Network will focus on providing a forum for EHS Professionals to Develop Best Practices Benchmarks. This forum will cover changing codes, listing and certification, redundancy, by products and more.

Roundtable 2 – Room: Rhythm 1

ESH Management of Compound Semiconductors
Moderator: Brett Davis; Motorola
Lunch Sponsored By: Locus Technologies
The ESH Management of Compound Semiconductors Round Table will focus on establishing an EHS professionals network for benchmarking and developing best practices for compound semiconductor manufacturing operations. Complimentary lunch will be provided to the first 50 attendees.

Friday, April 15

Roundtable 3 – Room: Bayside B
PFC Update
Moderator: Walter Worth; International SEMATECH
Lunch Sponsored By: URS
The PFC Round Table will provide an overview of all the current technology that has been developed and is in use to minimize the emissions of PFC. There will also be an opportunity for professionals to discuss the technologies that are currently being used and any challenges associated with each. Complimentary lunch will be provided to the first 50 attendees.

Roundtable 4 – Room: Bayside A
SERF Round Table
Moderator: Pete Monti
The SERF Round Table is planning to work on the next revision to the SERF manual in the upcoming year. They hope to establish sub-committees in the forum for the purpose of improving existing sections and creating new chapters in the manual on issues that were not addressed in the initial realize.

SESHA 2001 Symposium – Abstract View

Abatement of Effluent Species from MOCVD Processes

Faller, Rebecca (ATMI, San Jose, California and )
Cheung, Beverly (SAME)

One of the fastest growing semiconductor markets is the compound semiconductor arena, which includes products such as light emitting diodes (LED’s), high temperature semiconductors, and high frequency semiconductors for telecommunications devices. A commonly used manufacturing method for III-V compound semiconductor devices is metal organic chemical vapor deposition, commonly referred to as MOCVD. The III-V compound semiconductors include metals or semimetals from Group III of the periodic table, such as Al, Ga, or In as well as non-metals from Group V of the periodic table. Typical precursor materials for the Group V constituents of compound semiconductors include arsine (AsH3) and phosphine (PH3). Because of the highly toxic gaseous nature of these materials, abatement equipment is necessary to control the emission of materials at MOCVD process exhausts. Abatement equipment must be highly effective in the removal of these hazardous materials to below the respective threshold limit values (TLV). Traditionally, abatement of toxic exhaust gases from MOCVD processes has been performed by dry scrubbing methods. While this method has been highly effective, problems such as high temperatures can arise during abatement due to the nature of the abatement chemistry. This paper describes a customized dry scrubber product to be installed at the exhaust of MOCVD processes. This product is not only capable of abating all process exhaust gases to below TLV, but also controls unwanted temperature conditions. The customized dry scrubbing product described herein provides a safe, cost effective method of abating highly toxic MOCVD process effluents.

SESHA 2001 Symposium – Abstract View

Exhaust Management for the 21st Century: 20 Years In Development

Walker, Bruce G. (TECHNOLOGY PERFORMANCE Group, Kuna, ID)

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Exhaust and cleanroom air management is on an evolutionary curve where experience and engineering solutions have yielded significant improvements for processing equipment and cleanroom air management. Protecting personnel and the environment has top priority, but that priority is not always shared with equipment design and manufacturer specifications. Elevating the awareness of the long-term effects of exposure to toxic chemicals brings exhaust and air management into a new role in equipment design. However, few equipment designers have the depth of experience required to focus on the safe handling of toxic exhaust and optimal equipment performance. Comprehensive design requires knowledge of past sins. Repetitive learning should not mean repeated mistakes. Implementing case studies, process parameters and computational modeling leads to an inclusive air management design. The focus must remain on critical capture, containment and consumption making exhaust optimization a primary design element. Wet cleaning equipment is the extreme example since it typically exhausts at 1500 cfm and above but often does not adequately contain chemical fumes. Safely reducing the exhaust rate has significant EHS, operating, and capital cost avoidance implications. Isolation of the chemical processing tanks using an air manager system to effectively isolate and control fume emission, allows exhaust reductions in excess of 50%. Energy savings with this approach are estimated at $3-4/cfm per year. The capital cost to install cleanroom exhaust runs about $80-100 per cfm. Return on investment is quickly realized while a more effective chemical containment promotes the achievement of the energy reduction goals established in the National Technology Roadmap for Semiconductors.

SESHA 2001 Symposium – Abstract View

Development of an E-Business Tool to Facilitate the Equipment Procurement Process

Harralson, Mark (Intel Corporation)

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Ensuring the acquisition of safe and compliant semiconductor manufacturing equipment requires a very detailed process between the candidate suppliers and equipment end-user. In any selection, each supplier will be required to provide reports of compliance to several industry guidelines (i.e. SEMI S2, SEMI S8). Each of these documents will have deliverable dates, driven by the equipment selection date, which must be tracked. These supplier provided reports need to be reviewed by several different individuals often at different sites. A detailed corrective action plan will be developed by each supplier based on these compliance reports. This corrective action plan is a living document continuously reviewed by Corporate EHS, technology development and volume manufacturing sites. The performance of the supplier in providing these documents at the right time, and the results of the equipment evaluation, are used to create a supplier scorecard Intel can use to evaluate overall supplier performance. Following selection and implementation, the volume manufacturing sites will commonly perform analyses on the tool and potentially create projects for continuous improvement of the tool. We close this information loop by educating the tool selection personnel on the continuous improvement details so that they know what to look for in future selections. The effective sharing of this information and the need to capture all data into one central location has prompted Intel Corporation to develop a web based e-Business tool we call the “Equipment Workstation”. This paper will describe the Equipment Workstation in detail, how it’s capability has improved the efficiency of the procurement process, How we are now able to trend EHS performance over time, how data updates are available world wide instantaneously, and how we intend to improve it in the future by making the database directly available to our suppliers via the web.

SESHA 2001 Symposium – Abstract View

Application of a Graphical 3-D Finite Element Computer Model to Characterize and Depict Airflow Patterns in Exhausted Enclosures such as Gasboxes.

Hatfield, John (Earth Tech Microelectronics Group)
Ody, Phillip (Earth Tech Microelectronics Group)
Funk, Rowland (Earth Tech Microelectronics Group)

A visual software based format for describing the airflow patterns in exhausted enclosures has been developed. This methodology utilizes a 3-D Finite Element computer model to provide a graphical means of depicting the airflow in exhausted enclosures. Constant velocity contour lines provide a characterization of airflow patterns in enclosures to facilitate identification of areas with inadequate ventilation. This method is based upon a similar approach used for characterizing the topographical iso-concentation curves for chemical plumes in soil and groundwater investigations. The application of this type of approach to airflow in exhausted enclosures provides a visual summary of the airflow patterns inside of the enclosure as a function of the hardware configuration present. This type of application is especially useful for systems using flammable gases or vapors because of the potential explosion or fire hazard if the gases are released in an area of low velocity airflow (dead spot) near a source of ignition. This methodology can be used to show differences in airflow patterns based upon changes in hardware configuration inside of the enclosure (e.g., changes in locations of MFC, baffles or other components in a gasbox). An example of this approach using a visual 3-D format will be presented using velocity measurement data from a gasbox.

SESHA 2001 Symposium – Abstract View

Health, Safety and Environment considerations and solutions for large scale molecular beam epitaxy

Middleton , Peter (Filtronic Compound Semiconductors Ltd)

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3:5 technology is not new and many companies have carried out relatively small operations for around 20 years .Recent developments have led a number of organizations to move to larger scale production one of the process’ being molecular beam epitaxy .With this shift in production output comes a whole new set of challenges in Health , Safety and Environment issues which have to be addressed .This paper will present a review of the hazards and what Filtronic Compound Semiconductors Ltd has done to address the various concerns. These include :The use of large quantities of toxic metals; Generation of Hydride gases Contamination: personal and environmental;Use of cryogenic material;Ergonomic considerations; Maintenance and cleaning;Disposal and recovery. Pictorial and graphic evidence will be produced to demonstrate comprehensive coverage of all these aspects.

SESHA 2001 Symposium – Abstract View

EHS Evaluation of Germanium Tetrafluoride and Decaborane as Ion Implant Source Materials

Roberge, Steven (Axcelis Technologies, Inc. Beverly, MA)
Crane, Lauren (Axcelis Technologies, Inc. Beverly MA)
Emmerich, Ron (EORM, Boston, MA)

Interest in germanium tetrafluoride and decaborane as ion implant source materials is increasing. Both of these materials are considered to be extremely toxic, however applicable toxicological literature is limited. EHS evaluation of these materials is complicated by the lack of direct sampling techniques and the potential complex chemical reactions taking place in the ion source. This presentation will focus on methods of evaluating the EHS considerations in handling the materials, and operating and maintaining the equipment. Recommended safety precautions and exposure monitoring techniques will be included.

SESHA 2001 Symposium – Abstract View

Unique Industrial Hygiene Concerns in Gallium-Arsenide Device Manufacturing Facilities

Jones, Anthony (Motorola, Tempe, AZ)

While there are many common manufacturing processes and equipment found throughout the semiconductor industry, gallium-arsenide device manufacturing introduces a variety of unique industrial hygiene concerns which may not be present or of significant concern in silicon-based manufacturing operations. This paper will describe and evaluate several examples illustrating this notion and provide a working platform for effective industrial hygiene management in a gallium-arsenide device manufacturing facility.

SESHA 2001 Symposium – Abstract View

SEMI S14 Fire Risk Mitigation using Air Sampling Smoke Detection

Wyman, Matt

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SESHA 2001 Symposium – Abstract View

Abatement of Fluorine Process Emissions Utilizing Point-of-Use Abatement with Steam Injection

Jones, Robert (Lucent Technologies)
Flippo, Belynda (ATMI)

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The industry-wide focus on the reduction of perfluorinated compound (PFC) emissions has prompted the employment of alternative process chemistries and process tool optimization for dry etch and chamber clean processes. The PFC reduction efforts, however, have resulted in an increase in toxic and corrosive fluorine (F2) gas emissions and the subsequent abatement requirements. ATMI has focused significant efforts upon the development of an efficient and cost-effective point-of-use abatement solution for the reduction of F2, and other fluorinated byproducts, such as hydrogen fluoride (HF) and silicon tetrafluoride (SiF4). ATMI’s efforts have resulted in the development of a non-fuel abatement system (use of steam in oxidation section). This report documents the qualification of the ATMI CDO? 863 for F2 abatement on a nitrogen trifluoride (NF3) chamber clean at a semiconductor manufacturing facility.

SESHA 2001 Symposium – Abstract View

Environmentally Compatible Advances In Semiconductor Tool Part Cleaning Technologies

Zuck, Dave (QuantumClean Corporation)
Macura, Kurtis (QuantumClean Corporation)

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For the past three decades, semiconductor manufacturers have traditionally cleaned semiconductor tool parts “in-house”. Methods to clean parts, many still in use today, originated in the 70’s, when chemicals and labor were less expensive, when numerous water treatment/discharge and air quality standards did not exist, and when water was not considered a “precious” resource. Cleaning methods were often not formulated with extension of part life as primary objective. Advances in tool part cleaning technology, did not keep pace with the rapid advances in semiconductor manufacturing technologies, as “part cleaning” was considered a “non value added” activity, receiving little to no R&D investment.

This paper will evaluate recent advances in part cleaning technologies that significantly reduce and/or eliminate acid, solvent and DI water usage and waste generation. Specific technologies include carbon dioxide liquid and ice blasting, reduced acid/water cleaning, and a solvent/piranha replacement technique utilizing liquid and vapor DI/Ozone. Associated Ozone and Arsenic particulate monitoring, HEPA particulate abatement, fume abatement, and DI water recycle issues will also be discussed. These advances have also led to extended part life, and reduced the “Cost Of Ownership” of part cleaning. In addition to cost and environmental benefits, these techniques are producing measurably “cleaner” parts required for shrinking device line widths and increasing wafer sizes.

SESHA 2001 Symposium – Abstract View

Exhaust Optimization for Flammable Gas Use

Peterson, Susan (Earth Tech, San Jose, CA)

Reduced cost of ownership and less significant environmental impact can be realized by minimizing the safety exhaust required on semiconductor manufacturing equipment. Use of toxic and flammable gases or liquids presents a special challenge for optimization. Guiding principles are not available in determining how much exhaust is “safe” with regard to flammables, let alone “optimized.”. This presentation will explore approaches to ensuring safe and efficient exhaust flow on equipment that uses both toxic and flammable gases or liquids.

SESHA 2001 Symposium – Abstract View

Unique EHS Challenges in the Compound Semiconductor Environment

Romanow, Kerrie (EORM, Sunnyvale, CA)

Compound semiconductor operations offer hazards not commonly found in silicon processing fabrication facilities. The EHS professional faces different regulatory requirements and challenges. This presentation will provide an overview of the different technologies and chemicals utilized in compound semiconductor environments. The focus is to provide insight into the diverse EHS considerations confronting EHS professionals in this industry. The goal is to provide a framework to set the stage for the balance of the Compound Semiconductor section of the Environmental track.

The author will provide real life examples from her tenure as the EHS and Facilities Manager at a Compound Semiconductor fab in Santa Clara, CA

SESHA 2001 Symposium – Abstract View

Emergency Release Abatement of MOCVD Precursor Materials

Faller, Rebecca (ATMI, San Jose, California)
Cheung, Beverly (SAME)

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A commonly used manufacturing method for III-V compound semiconductor devices is metal organic chemical vapor deposition (MOCVD). Products resulting from MOCVD processes include light emitting diodes (LED’s), high temperature semiconductors, and high frequency semiconductors for telecommunications devices. Typical precursor materials for MOCVD processes include arsine (AsH3) and phosphine (PH3). These materials are highly toxic and are generally packaged, stored, and delivered in high-pressure cylinders. The toxicity and pressure of the gases have the potential to create disastrous consequences if released in an uncontrolled manner. Although the gases are typically utilized within gas cabinets, should a release of the gas occur, the exhaust of these secondary containment devices ultimately flows to the atmosphere. Abatement devices are used to protect the surrounding community from exposure to hazardous materials, should an emergency situation arise. Several areas have requirements for facilities using arsine or phosphine pressurized gas cylinders to provide a mechanism to reduce exhaust concentrations to specified concentrations. Abatement tools must be highly effective in order to remove these hazardous materials to below one-half of immediate danger to life and health (IDLH). This paper describes a customized bed of dry scrubbing media that is installed at the exhaust of the secondary enclosure. This product is not only capable of abating arsine and phosphine to below one-half IDLH during an emergency release scenario, but it is also provides non-flammable and irreversible abatement of these gases. The emergency release scrubber described herein provides excellent technological advantages over the traditional carbon beds.

SESHA 2001 Symposium – Abstract View

Removing Arsenic from GaAs Process Wastewater

Peterson, Joel (Motorola SPS, Tempe, AZ)

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The recent increase in demand for gallium arsenide (GaAs) integrated circuits presents manufacturers with many significant challenges, including compliance with arsenic wastewater discharge limits. Violating this limit can result in fines, interruption of operations, and even criminal liability. Recent action in the US regulatory arena suggests that this limit is likely to decrease substantially in the near future. Consequently, managing this aspect of GaAs device processing could have a significant impact on sustaining fab operations. The characteristics of arsenic-bearing wastewater streams are described as well as the processes and associated chemistries employed in conventional arsenic removal. The behavior of GaAs particles are described and their interaction with conventional removal processes is discussed. A brief overview of available and emerging technologies for the removal of arsenic is presented as well as the results of recent treatment advancements in the Motorola “CS1” wastewater treatment operations.

SESHA 2001 Symposium – Abstract View

Safe Handling of Compound Semiconductor Exhaust Effluent

Van Gompel, Joe (BOC Edwards, Austin, TX)

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Compound semiconductors such as gallium arsenide, indium phosphide, and indium antimonide use a number of very hazardous gases during deposition steps. These gases include arsine, phosphine, trimethyl indium, germane, silane, dimethyl zinc, and others. Removal of unconsumed process gases, as well as the products of the deposition process, is problematic in that some methods of disposal leave the process engineer with something nearly as toxic as the original gases. Worst among these is arsine, which will always produce an arsenic-tainted waste stream. In addition to the waste gases themselves are the hazards associated with pumping this exhaust, namely the sublimation of pyrophoric elemental phosphorus in the presence of high flows of hydrogen.Treatment of the compound semiconductor process exhaust can best be addressed from a systems approach. Combination of the vacuum line, vacuum pump, exhaust line, and abatement in a single footprint allows for seamless integration into the process. Integration offers significant installation savings as well as CoO advantages. The Zenith 3-5 Integrated Pump / Abatement package integrates the vacuum pump and abatement, allowing for thoroughly heated exhaust lines (eliminates phosphorus buildup) as well as a uniform interface to monitor pump and abatement. The abatement device, typically a Thermal Processor Unit (TPU) or its high H2 variant known as HELIOS, is a combustor / scrubber combination. The TPU provides hydride gas removal to below detectable limits while keeping HCl emissions at or below TLV during the etch step. The combustion products, including arsenic, phosphorus, and gallium oxides, are either filtered as solids in the Water Recirculation Unit or are dissolved in the water and sent to a suitable waste treatment facility capable of removing contaminants to levels acceptable for discharge.

SESHA 2001 Symposium – Abstract View

Navigating The Code In A High-Tech Environment – Tools To Enhance Code Compliance.

Frisch, Elizabeth (TNRCC)

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Facility engineers and technicians as well as environmental, industrial health, and safety professionals are required to navigate through a multitude of rules and regulations in order to maintain compliance with city, state, and federal law. The Environmental Protection Agency (EPA) and the Occupational Health and Safety Administration (OSHA) are the primary regulatory agencies from which the majority of our compliance standards originate. As professionals working in high technology industries, we gain comfort in these areas and operate under comprehensive environmental, health, and safety (EHS) programs. Often though, we can overlook the additional standards development bodies that on a day-to-day level, impact the operations of our facilities as much as, and in some cases more than any OSHA or EPA regulation. Organizations, like the International Conference of Building Officials (ICBO), the Building Officials and Code Administrators (BOCA), the Southern Building Code Congress International (SBCCI), and the National Fire Protection Association (NFPA) have created broad-reaching standards that affect every aspect of the construction, operation, maintenance and modification of hi-tech facilities. We commonly refer to the standards as “codes”. Typically, any area of the facility can be covered by the Uniform Building Code (UBC), Uniform Fire Code (UFC), Uniform Mechanical Code (UMC), and the National Electric Code (NEC). Some sites may be subject to different requirements than listed above depending on the area of the country such as the SBCCI, NFPA, and BOCA. Maneuvering through the multitude of codes can be confusing as well as intimidating. Knowing when changes in operation or in the type or quantity of chemicals used, triggers additional code requirements is challenging. This presentation is focused on the requirements affecting hi-tech facilities that use or produce hazardous materials and is designed to give the participant an overall understanding of codes that apply in all phases of design, construction, retrofit, and operation. We will review each of the codes and identify the “hot” sections that will typically be used by facility and EHS professionals. These sections will be discussed in further detail to allow personnel to recognize issues with occupancy classifications, HPM limits on storage and handling, fire suppression, ventilation, and life safety alarm and monitoring requirements. Finally, the presentation will help companies develop strategies for compliance to address new project and renovation requirements and reduce liabilities.

SESHA 2001 Symposium – Abstract View

2000 Codes Affecting Hazardous Gas Monitoring

Logan T. White, P.E. (Logan T. White Engineering)

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In the year 2000, the International Fire Code was published as the culmination of an effort to develop a model code acceptable to jurisdictions throughout the United States. During the code development process, some organizations dropped out of the International Fire Code and published a 2000 edition of the Uniform Fire Code. This paper will review 2000 IFC and UFC code requirements affecting hazardous gas monitoring. Both codes reference nationally-recognized standards and call for gas detection and alarm systems to be listed or approved. This paper will outline standards that address these issues.

SESHA 2001 Symposium – Abstract View

Beyond Compliance: Contingency and Disaster Planning

Taylor, Kiley (Zephyr Environmental Corporation, Austin, Texas)

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Contingency and disaster plans are a part the regulatory compliance landscape. Facilities develop and maintain plans to address numerous regulatory requirements, but are such plans functionally viable in a real emergency? This paper focuses on both the regulatory requirements and good business practices of emergency planning. The objectives of the paper include examining EPA, OSHA, and DOT planning requirements, and then building truly integrated contingency plans and “all hazards” planning. Examples of such plans for selected communities and industrial sites are used to demonstrate functionality and usability.

SESHA 2001 Symposium – Abstract View

Current Perspectives in Industrial Hygiene–Microelectronics Manufacturing

Aton, Elizabeth (Washington University School of Medicine)

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The model for industrial hygiene practice, RECOGNITION => EVALUATION => CONTROL can be efficiently interpreted in the framework of the microelectronics manufacturing process. In this presentation process materials and operations are analyzed for their potential health implications, and control measures common to industry practice are reviewed. Specific variables assessed include physical agents and air contaminants. The second section of the presentation focuses on emerging issues in occupational and community health, for microelectronics and related high-technology workplaces.

SESHA 2001 Symposium – Abstract View

TI New Material ESH Screening

Lotspeich, Christie (Texas Instruments, Dallas, TX)
Dawson, Kim (Texas Instruments, Dallas, TX)
Menon, Manju (Texas Instruments, Dallas, TX)

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Texas Instruments (TI) has adopted a program for the selection of chemicals and gases at its fabrication facilities worldwide. The new program replaces a number of informal programs and provides a more disciplined, standardized approach. A major benefit is that environmental, safety and health concerns will be now be addressed in the beginning when TI engineers are considering making changes in manufacturing processes or using new chemicals and gases. This program will be used whenever TI considers using a new material, makes a change in its manufacturing process or uses a process or material that’s new to a specific site. In addition, it provides steps to take whenever new environmental, health or safety information is available for a material or process that is being used at a TI facility.The program is designed to help ensure that TI’s processes and materials are safe and environmentally friendly. By addressing these issues in the beginning when TI engineers are considering making changes that will require new chemicals or gases, the company can eliminate any potential problems before they become a part of the manufacturing process. Also, evaluating these issues early in the planning process can be more cost effective and can help the company move new products from design to market faster. Finally, the new program will help the company make sure that it’s compliant with government regulations throughout the world.

SESHA 2001 Symposium – Abstract View

Gas Chemical Systems

Benson, Roger (FM Global)

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A look at this using the concepts of 1) Isolation, 2) Segregation, 3) Ventilation, 4) Detection, 5) Limitation and 6) Mitigation. We will look at the source areas, distribution systems and event the effluent treatment systems. We will focus on the above basic safety methods as incorporated in the overall design of a process gas or chemical system.

SESHA 2001 Symposium – Abstract View

Using a Modified HazOp/FMEA Methodology for Assessing System Risk

Trammel, Steven (Motorola Semiconductor Products Sector, Austin, TX)
Ronald D. Wright and (Motorola Semiconductor Products Sector, Austin, TX)
Brett J. Davis (Motorola Semiconductor Products Sector, Austin, TX)

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As semiconductor manufacturing processes become more complex and the costs associated with manufacturing line downtime soar, the reliability of the supporting systems have become a major area of focus. Preventive and predictive maintenance, real time system status monitoring, and periodic inspections are typical methods used to help reduce unexpected system failures. Although these methods are proactive, they are typically applied on the basis of perceived risk or solely on the historical perspective of the designer or owner. Utilization of a robust and flexible system risk assessment method early in the design phase is a highly effective approach to increasing system up time and to identify design weaknesses. This paper will present a risk assessment approach based on strengths of both Hazard and Operability Study, and Failure Modes and Effects Analysis methodologies. Also presented are several case studies which demonstrate the power of this combined approach.

SESHA 2001 Symposium – Abstract View

Equipment Fire Risk Assessment: Issues Arising From The First Year of Implementation of SEMI S14-0200

Brown, Alastair (Rushbrook Consultants, Glasgow, Scotland)

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The breakthrough that took place in February 2000 when S14-0200 was published was significant; with a requirement being introduced for the first time that all equipment being built to SEMI Standards should have a fire risk assessment completed. The guidelines are strong on hazard identification, and provide a method for categorising risk, however they only provide limited guidance on what is required to complete an adequate risk assessment. Due to a small number of fire engineers available with sufficient knowledge and expertise to complete the work, initial assessments have set the standard for others to follow. Using his experience of a wide range of semiconductor equipment and facility fire risk assessment the author examines some of the issues arising from the implementation of S14-0200, both from fire engineering and risk assessment perspectives and considers some of the anomalies that the standard has introduced. The paper will discuss issues of interest to experienced third party assessors and to product safety and design engineers with an interest in fire risk assessment and the S2 and S14 assessment process.

SESHA 2001 Symposium – Abstract View

Multi-layer Protection Analysis for Manufacturing Facilities

Fthenakis, Vasilis (Brookhaven National Laboratory)

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This paper presents an accident prevention and mitigation strategy for high-tech industries, based on the concept of defense in depth; if one line of defense fails, then others are available. Engineering and administrative options to prevent and control accidental releases and reduce their consequences are considered sequentially in six steps: i) inherently safer technologies, processes and materials; ii) safer use of a given material; iii) means to prevent accident initiating events; iv) safety systems to minimize releases at the source; v) systems to contain accidental releases; vi) options to prevent or minimize human exposures and their consequences. Specific options available to the semiconductor industries are discussed.

SESHA 2001 Symposium – Abstract View

Applying “Process Hazard Analysis”, Designing EHS Compliance into a 150,000 ft2, 300mm Fab

Bilimoria, Sarah (Applied Materials)
Mary-j Klang (Applied Materials)

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Early identification of hazards makes responsible business sense. Process Hazard Analysis (PHA) provides a systematic way to identify potential hazards associated with a tool or system. PHA, when used in design phase, provides a format for facilitating dialog and cross checking between design teams.

During design of the 150,000 ft2, 66 tool Bay, Applied Materials Technology Center, PHAs were a tool used to ensure the EHS Design Team goals were met These goals included; operability of the system, bullet proofing for regulatory compliance, no single point of failure resulting in violation of any permit conditions, and safety of the system. While Applied Materials had often utilized PHA, this process was targeted at tools, and had not been used consistently for building related systems.

At 30% conceptual “black box” design, the EHS Design Team used What If Analysis to identify showstoppers and critical path design requirements. At 60% and 90% design, a detailed Hazard and Operability Analysis was conducted. During design phases, over 20 PHAs were conducted for systems that posed EHS risks: Bulk/Specialty Gas; AWN, HF and Slurry Treatment; Abatement Devices; Wet Labs; Chemical and Waste Handling; Life Safety Systems; and an Automated Material Handling System.

The EHS Design Team raised the bar for bulletproofing system compliance. Using a proven process, PHA, and adapting this tool for design review, the Team was able to partner for success with Designers, Operations, Facilities, Vendors and Regulators. This presentation will outline among other things; lessons learned, usable PHA tools, methods to identify and maintain key partners, and ways to overcome resistance to the PHA process.

SESHA 2001 Symposium – Abstract View

Challenges in Human Factors Engineering of 300 mm Semiconductor Manufacturing and Equipment.

Macklin, Ronald (Applied Materials, Inc., Santa Clara, CA)
Junge, Maria (Clayton Group Services, Pleasanton, CA)

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As the Semiconductor Industry drives toward larger wafer sub-straights, there continues to be an increasing emphasis on maximizing floor space within the semiconductor fabrication plants, decreasing the room once available for maintenance activities. The increase of component size, due to larger wafer sizes, will affect equipment size thereby further influencing the footprint of equipment. Access to equipment for maintenance and repair will be smaller than ever before. Therefore, maintenance and service processes will have to be efficient, taking into account both size and capabilities of the operator/technician. 300 mm wafer fabrication alone is leading us to increase levels of automation. Human factors engineering and ergonomics must be important to both the equipment designer and the end user in order to optimize access and operation of equipment. From the design viewpoint, Applied Materials, Inc. is actively working on solutions to the challenges of small equipment footprints and tooling for maintenance and serviceability of larger and more complex systems. The issues of automation in semiconductor fabrication processes with human interaction are sometimes difficult to solve. The emphasis is on the Supplier Ergonomics Success Criteria (SESC) checklist within the SEMI S8 Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment standard. The specific topics of concern to Applied Materials are (1) manual handling equipment for 300 mm components; (2) in-situ handling and maintenance aids; (3) human factor issues; (4) design of clean room compatible tools to properly and safely perform required operational or maintenance functions. Examples of each of these topics will be shown and discussed in detail. Recommendations for further improvements will also be addressed.

SESHA 2001 Symposium – Abstract View

Ergonomics Work Management Model

Duke, Larry (SabFab Solutions, LLC)

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ith the onset of increased reporting of Musculoskeletal Disorders (MSDs) by U.S. Industry in the late 1980s much attention was turned to the subject of ergonomics. Ergonomics in the 1990s spawned what is arguably the single most significant workplace safety issue in recent history, one likely to continue well into the new millennium.
The subject has fueled a multitude of academic studies, linking MSDs to poor ergonomic workplace conditions. It has been a hotbed within OSHA’s regulatory process and may ultimately result in a federal ergonomics standard.

OSHA reports that MSDs account for $15-20 billion annually in worker’s compensation costs to employers. For years companies have been implementing ergonomics programs to combat worker’s compensation costs and to protect workers, with overall positive results.

Figures for the semiconductor industry indicate that the proportion of cases associated with ergonomic conditions is approaching 60 percent of the total cases. A statistic that has not gone unnoticed by progressive semiconductor companies that address ergonomics as part of their overall environmental, health and safety (EHS) strategy.
However, even with all the attention ergonomics is getting and the evidence that ergonomics improvements can prevent employee injuries, the person within a semiconductor company responsible for implementing ergonomic improvements may still find it a “hard sell” to management. Especially beyond the basic program elements and quick-fix solutions when ergonomic retrofits must compete for resources with other higher profile EHS issues.

A systematic, focused approach that allows for and prioritization of ergonomic issues within a company can build a strong case for going beyond the traditional limitations of an ergonomics program. Analysis and planning is a must for insuring that adequate resources are identified and directed toward the highest priority opportunities for ergonomic improvements.

This paper explores a model for systematic planning and prioritization that includes three primary steps: 1) Assessing needs through data collection and analysis; 2) Characterizing resource requirements for priority needs; 3) Targeting the best solution to meet the need.

SESHA 2001 Symposium – Abstract View

Changing the Ergonomics Model for Transfer of New Technologies

Lostetter, Michael F. (Intel, Chandler, AZ)

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Historically, the majority of ergonomics issues at Intel and many other companies have been identified and resolved during and after the ramp up of high-volume manufacturing (HVM) facilities. This is an issue for three reasons: employees are injured before issues are resolved, employee productivity suffers, and millions of dollars are spent correcting the issues. At Intel, these problems have been a result of the resourcing model for EHS being heavily weighted at the manufacturing sites and less so at the development sites. In order to address this problem, an experienced seed ergonomics engineer was assigned ownership of developing and completing the ergonomics deliverables for transferring a new technology. The goal of this resourcing model is to deliver the new technology with no or minimal HVM equipment ergonomics retrofits. The same model was used in parallel for all of the EHS disciplines.Tasks of the Ergonomist included completing proactive ergonomics evaluations to identify SEMI non-compliances, integrating identified issues into supplier corrective action plans for closure prior to HVM, ensuring proper documentation of administrative controls, and identification of and resolution of other potential HVM issues. As many as ten to fifteen ergonomic issues were identified per tool one year prior to HVM startup. This allows up to a year to develop and implement the recommended solutions before an HVM employee has to work on the equipment. Solution development is underway at this time. This is a major improvement to the EHS model and should provide a reduction in injury rates resulting in higher productivity and should nearly eliminate HVM equipment ergonomics retrofits resulting in significant cost reduction.

SESHA 2001 Symposium – Abstract View

An Ergonomic Assessment of Manual Handling of Reticle Pods.

Selan, Joseph (Advanced Ergonomics Inc.)
White, Keith (Texas Instruments)

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An ergonomic assessment of reticle pod handling was conducted. Thirty Photo Operators participated in the study. They were asked to handle 6 and 1-reticle pods using 1 or 2 hands at 38, 57, and 63 inch handling (load port) heights, as well as to determine their own preferred handling height. Operators rated each lift on a 10 point perceived exertion (Borg) scale. Body angles were measured for comparison with semiconductor industry ergonomic guidelines. Based on the data:

1. The 57 and 63 inch load port heights were determined to be unacceptable for manual handling of either 1 or 6-reticle pods
2. The handling of 6-reticle pods was only acceptable if 2 hands could be used to handle the pod, and the load port height was 38 inches or the user-preferred height.
3. The handling of 1-reticle pods was acceptable using either 1 or 2 hands, provided the load port height is 38 inches or the user-preferred height.

Ergonomic controls were developed to address the identified issues, and are discussed in the report. The relationship between the findings of this study and ergonomic guidelines put forth in SEMI S8-0600 “Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment” are discussed. The findings of this study appear to validate industry ergonomic design guidelines.

SESHA 2001 Symposium – Abstract View

A Review of Ecosystem Protection Efforts by Regulators

Chiscano-Doyle, Carina (International Center for Toxicology and Medicine, Rockville, MD)
Nealley, Mark
Pirages, Suellen

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Ecosystem concerns have gained more serious consideration by state and federal regulators since 1990. A series of guidances have been produced by regulators in the last ten years which describe basic principles of ecological risk assessments. Guidances for ecological risk assessments help improve the quality of ecological risk assessments and entail different approaches which have been developed by different programs. These approaches include: tier, baseline vs. screen level, and screen level. The purpose of this paper is to highlight guidances previously used in different programs with a major focus on issues of concern in the most recent guidance, The Screening Level Ecological Risk Assessment Protocol (SLERAP). Examples are provided for each major area of concern in SLERAP: 1) a protocol too complex for a screen level approach; 2) the basis for experimental assumptions are questionable; 3) a high level of uncertainty exists due to default values; and 4) the relationships characterized by algorithms are not verified or validated in natural ecosystems. We also discuss an alternative method for screening using comparisons between ecological threshold values for measurement receptors being evaluated.

SESHA 2001 Symposium – Abstract View

Small Business Suppliers – Environmental Stewardship From the Bottom Up

Frisch, Elizabeth (Texas Natural Resource Conservation Commission)

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As professionals involved in the semiconductor industry, we spend a significant amount of resources maintaining and continually improving environmental compliance at our facilities. Sometimes, we miss a very important opportunity to ensure that many of the industries that support our facilities from drycleaners to autobody repair shops, print shops, and metal finishing facilities maintain the same standards. Most small businesses that support this industry do not have the resources or expertise to ensure that they are also in compliance with the multitude of regulations that apply to them. As a result, they end up in enforcement when stewardship by their customers could have ensured they also maintained compliance. The TNRCC Small Business and Local Government Assistance Section has developed a free, confidential compliance assistance program that focuses on small businesses that support the larger industries including printers, surface coaters, autobody & autorepair, metal platers & finishers, thermoset resin, dry cleaners, landscapers, and other related industries. The section has created multimedia compliance checklists for these industries which lets them be aware in “plain language” what their requirements are and stay out of enforcement. In addition, site visits are completed to small businesses that gives them a free and confidential assessment of their compliance status without fear of enforcement as a result of the visit. This presentation will discuss how this program was established, review the compliance assessment checklists, and outline typical environmental issues faced by these suppliers. In addition, it will provide the framework for using these tools to ensure that your suppliers are also in compliance and have the resources to maintain the same standards as your facilities.

SESHA 2001 Symposium – Abstract View

Novel Wafer Cleaning Technologies Survey

Pawsat, Sally (International SEMATECH, Austin, TX)

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Effort continues in the semiconductor industry to identify novel wafer cleaning technologies that offer lower water and chemical consumption and move towards more benign chemistries for both front end and back end process applications. Six emerging novel cleaning methods are reviewed in this paper: DI/Ozone (DIO3), DI/Hydrogen, Supercritical CO2 (SCCO2), Densified Fluid Cleaning (DFC), Steam Vapor, and Sulfur Trioxide (SO3). For each technology, the paper will discuss cleaning mechanism, process chemicals and conditions, environmental, safety and health issues and technology status. The process application, contaminants removed and chemistries replaced will be identified.

SESHA 2001 Symposium – Abstract View

EHS Considerations For Very Large Chemical Systems in the Semiconductor Industry

Beasley, James (Intel Corporation, Hillsboro, OR)

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As semiconductor manufacturing facilities become larger to satisfy increased demand for electronic products, EHS professionals will be faced with the challenge of evaluating and establishing EHS requirements for the handling and distribution of ever-increasing quantities of hazardous chemicals. This presentation will delineate the drivers for increased chemical usage in the semiconductor industry, explore domestic and international regulatory considerations, and describe a proven approach to evaluating and approving large-scale chemical distribution schemes. Additionally, the role and importance of EHS in the design and operation of safe, reliable large chemical systems will be illustrated. The presentation will close with a prediction of future hazardous chemical use trends for high volume manufacturing.

SESHA 2001 Symposium – Abstract View

Identifying, Rating and Measuring Environmental Aspects for ISO 14000 Registration: An Approach That Works.

Aichelmann, Richard (Axcelis Technology, Inc.)

The ISO 14000 standard requires that an organization “establish and maintain (a) procedure(s) to identify the environmental aspects of its activities, products or services that it can control and over which it can be expected to have an influence, in order to determine those which have or can have significant impacts on the environment.” In this paper the author will present proven techniques for identifying and rating the significance of the impacts of an organization’s environmental aspects. The methods presented are ones actually employed by organizations that successfully implemented Environmental Management Systems that achieved registration to the ISO 14001 standard. Emphasis will be placed on procedures that are extremely simple to implement. Finally, examples of some approaches for monitoring and measuring improvements of the significant impacts will be briefly discussed.

SESHA 2001 Symposium – Abstract View

Environmental Performance Reporting- Using the ISO 14031 standard as a guide to develop an Environmental Performance Evaluation for your Environmental Management System.

Schmitt, Shannon (Hyundai Semiconductor America, Eugene, OR)

Beyond ISO 14001 certification, many organizations are looking for methods to help them further improve and understand their Environmental Management Systems (EMS). This paper details the process of establishing an Environmental Performance Evaluation(EPE) for Hyundai Semiconductor America (HSA), an ISO 14001 certified microelectronics manufacturer. HSA used the ISO 14031 standard as a guide to develop environmental performance criteria, provide management with information about EMS performance and evaluate the adequacy of the system in meeting its performance criteria. This paper discusses the process used to select indicators, collect and analyze relevant data, report and communicate results, and review performance. Also discussed are the benefits derived from establishing an EPE and challenges faced in implementation.

SESHA 2001 Symposium – Abstract View

Understanding SEMI S2-0200 Environmental Requirements

Shree Dharasker (Applied Materials, Santa Clara, California)

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SEMI S2-0200, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, was technically approved and published by the Semiconductor Equipment and Materials Incorporated (SEMI) in February 2000. The new guideline updates the SEMI S2-93, and contains several new requirements for semiconductor manufacturing equipment. The environmental requirements in S2-0200 have been significantly modified with more focus on life cycle analysis and Design for Environment (DfE) principles. In order to inform and educate product design engineers about the new requirements, Applied Materials Environmental, Heath, and Safety (AMEHS) conducted several activities such as, preparing a SEMI S2-93/S2-0200 comparison matrix, developing a product environmental assessment procedure, and updating internal design processes with SEMI S2-0200 requirements. Several requirements have been standardized to achieve consistency across the company. This paper describes Applied Materials efforts to understand and implement the new standard, and incorporate DfE concepts into product design. It is expected that these efforts will result in increasing conformance to SEMI S2-0200 environmental requirements, greater awareness of product environmental issues, and improved DfE performance in the year ahead.

SESHA 2001 Symposium – Abstract View

Updating Global ESH requirements: A TI Case Study.

Schomer, Dawne (Texas Instruments)

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In this day of economic and trade globalization, multinational companies are responsible for an expanding number and type of requirements. The number of in-country ESH laws are increasing, and the number of international and regional Directives, Covenants, and Trade Agreements having environmental, safety and/or health requirements is growing. In addition, the scope of issues has expanded to include product-related concerns such as product content and product packaging. How are we maintaining visibility and management of these requirements? One element of Texas Instrument’s 2000 – 2001 ESH Strategic Plan is to ensure the robustness of our internal global business processes related to this challenge. How TI and other GEMI (Global Environmental Management Initiative*) companies are addressing this issue is the theme of this presentation. *See website for more information on GEMI: www.gemi.org.

SESHA 2001 Symposium – Abstract View

Alphabit Soup: An Overview of Environmental Regulations

Williams, Jeffrey (Department of Defense)

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During the last two decades, environmental issues have assumed a greater and greater role in the industrial workplace. Frequently, individuals whose background and training have been in only one of those areas cover the combined functions of environment, safety and health (ESH). In other cases, facilities engineers are saddled with environmental responsibilities. Finally, even new hires with environmental degrees may have backgrounds in engineering, but not in the regulatory arena. For individuals in these situations, understanding the alphabet soup of environmental laws, how they are developed and how they are enforced can be difficult.

This presentation will provide the newcomer to the environmental field with a basic overview of the environmental regulation process. A brief introduction will be given on how environmental laws are enacted and amended, and the development of those laws into regulations. The basic topics, laws, and major sections of the principle environmental laws will then be presented. Laws that will be examined will include those dealing with air, wastewater, stormwater, hazardous waste, site remediation, natural resources and community involvement.

SESHA 2001 Symposium – Abstract View

PFC Emissions Reduction Options —- A Selection Guide for the ESH Professional

Worth, Walter (International SEMATECH)

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After a half a dozen or more years of concerted effort by the tool and abatement equipment suppliers, the chemical suppliers, the IC manufacturers and various universities, several technology options for reducing PFC emissions are now commercially available. However, there is a need for an overview that will assist the ESH professionals and engineers charged with developing the implementation strategy for PFC emission reduction for a fab or company. This paper will review and compare the mature options form the standpoint of the user, namely the semiconductor manufacturing ESH professional. It will provide information on the capital and typical installation costs, cost of ownership, maturity of the technology, reliability, and size of the installed base. In the case of the alternative chemistries, it will compare the cost of the gases and the emission reductions achieved with each. For each option, the study will also attempt to address the net ecological benefit as well as the cost of ownership in terms of the carbon equivalent emission reduction.

SESHA 2001 Symposium – Abstract View

Toxic Release Reporting-Where It’s Been and Where It’s Going

Silberman, Karen (Motorola, Mesa, AZ)
Gibson, Sarah (Motorola, Austin, TX)

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The semiconductor industry has been required to file SARA Section 313 Toxic Release Inventory Reports for chemicals manufactured, processed or otherwise used in quantities that exceed regulatory threshold amounts since 1986. This presentation will show reporting trends for the semiconductor industry compared to overall reports in general, identify recent changes in Section 313 regulations that affect reporting requirements, discuss potential effects of PFC reduction strategies, list resources available to report preparers, and discuss opportunities to reduce reporting through release reduction projects.

SESHA 2001 Symposium – Abstract View

The Emerging (and Challenging) Role of Environmental

Trowbridge, Philip (AMD, Austin, TX)

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The role of environmental in multinational corporations is evolving as emerging global trends drive environmentally-related issues into the heart of the business decision process. Traditionally, environmental departments have functioned as the guardians of regulatory compliance related to air, water, and waste. Recent global trends toward more “environmentally friendly” products, increased disclosure of environmental performance and contribution to a sustainable future are placing a renewed emphasis on the integration of environmental considerations throughout all functions of the corporation from management actions to product design, manufacturing and end of life options. These trends are driven by a number of factors including new legislative initiatives and stakeholder concerns. The purpose of this presentation is to provide background information and the basic knowledge necessary to better understand the new terminology and directions of environmental departments within multinational organizations.

SESHA 2001 Symposium – Abstract View

New Equipment Procurement Process at Intel

Beaty, Cheryl (Intel, Rio Rancho, NM)
Craig, Leonard (Intel, Chandler, AZ)

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All new technology process equipment purchased by Intel must meet predefined criteria such as capability, yield, reliability, and cost of ownership including Environmental, Health, and Safety (EHS). The primary EHS criteria Intel holds its equipment suppliers to meet are SEMI S2 Safety Guidelines For Semiconductor Manufacturing Equipment and SEMI S8 Safety Guidelines For Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment. In addition to meeting these guidelines, the equipment suppliers need to meet additional requirements which include conformance to the applicable European Union Directives as well as environmental, flammability/combustibility, utilities, and electrical criteria. To better ensure new technology process equipment purchased meets Intel’s requirements, the seven component New Equipment Procurement Process (NEPP) is followed. The objectives of utilizing such a process include supplier development, purchase of advanced technology equipment that is safe, global placement of equipment, and continuous improvement for both the supplier and Intel. This paper will go into the details on each of the seven fundamental components of the procurement process and the benefits of following such a process.

SESHA 2001 Symposium – Abstract View

Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment

Sklar, Eric (Applied Materials, Santa Clara, CA)

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This paper begins with an overview of fire risks, highlighting the three elements of the fire triangle (fuel, oxidizer, and source of ignition) as the keys to understanding and mitigating fire risks in semiconductor process equipment. The assessment of risk, based on outcomes and their probabilities, is presented briefly. The criteria in SEMI S2-0200 Environmental, Health and Safety Guideline for Semiconductor Manufacturing Equipment are described. This recently-published version of S2 is less prescriptive than its predecessor (S2-93A), which results in the need for more thorough analysis, but permits a broader range of mitigation techniques. SEMI S14-0200 Safety Guidelines for Fire Risk Assessment and Mitigation is presented in greater depth. This latter Safety Guideline includes a detailed assessment process and criteria, which are intended to be used independently or in conjunction with the S2 assessment of equipment. The document also describes various available approaches to mitigation of fire risk (e.g., choice of materials of construction, separation of fuels from oxidizers, and suppression systems) and includes a general hierarchy of approaches (e.g., engineering controls are preferred to administrative controls), but allows for much professional discretion of the selection of fire risk mitigation methods by equipment designers. Lastly, some experiences from S14 evaluations will be described.

SESHA 2001 Symposium – Abstract View

Making Equipment Decommissioning & Decontamination a Part of Daily Operations

Maloney, Terence A. (AMD, Sunnyvale, CA)

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There are several circumstances that call for decontamination and decommissioning (D&D) of equipment contaminated with hazardous materials to prevent human or environmental damage. These include the complete shutdown and removal of all equipment from an area, the idling of some or all of the equipment in an area for an extended period of time, the disposal of damaged equipment, the replacement of obsolete equipment, and the transfer of equipment. During wafer fabrication facility closures, safely removing equipment and disposing of it is the primary focus of every individual involved. In other circumstances, the primary focus is always something else. Inherent in addressing equipment shutdown and removal ad hoc is the likelihood that the job will be done poorly or not done at all. It is important, therefore, that semiconductor manufacturing sites have formal procedures in place that ensure the identification of all situations in which D&D is appropriate; that ensure, in those circumstances, the identification of all equipment that might be contaminated with hazardous materials and need D&D; and that ensure proper D&D of all appropriate equipment. This presentation explains the business processes and operational procedures which have been used successfully address these needs at AMD’s Sunnyvale, CA site for more than 10 years.

SESHA 2001 Symposium – Abstract View

The Control of Hazardous Energies Standard and Elements of Implementation within a Semiconductor Manufacturing Facility.

Scully, Chris (Intel, Chandler, AZ)

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In this presentation I plan on discussing the key aspects of the Control of Hazardous Energies(COHE) OSHA standard in regards to a Semiconductor manufacturing facility. Intel’s lessons learned and best known methods will be outlined from our recent experience in implementing the COHE requirements across the corporation. Elements such as written program development, training, energy control procedure development, periodic inspection and re-certification shall be discussed. The challenges of COHE implementation across a diverse workforce including manufacturing and facilities maintenance will be a focal point of the presentation.