Decon and Decommissioning

January 8, 2025 - Decon and Decommissioning

Leading edge semiconductor FABs today, employ processes that use hazardous process materials (HPMs) that can lead to contamination within processing equipment. The raw material, contaminants and byproducts create a risk that must be managed during the equipment disposition and reallocation process. Failure to manage these risks can lead to significant liability to employees, contractors, and downstream handlers of the equipment. This presentation takes an initial look at the many aspects related to the management of equipment deinstallation. Formulation of a solid plan of action with assigned roles and responsibilities can minimize the risks created during the deinstall process. Information provided will overview one site’s strategy for de-install including sequence of operations using principles outlined in Semi S12 and site operational processes. Content is intended for EHS Professionals with experience in the Semiconductor Industry but lack professional focus on equipment install and deinstall processes.

SESHA

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This suite of online, on-demand courses, incorporating content from SESHA “boot camp” courses, provides a comprehensive safety training foundation for all employees who work in a semiconductor fabrication setting.


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